Resonant coupling type microstrip line interconnects using a bonding ribbon and dielectric pad have been designed and fabricated. The basic concept of this interconnect is the LC serial resonance of the pad capacitor and ribbon inductor. Both numerical simulation and experiment reveal low return loss and high efficiency connection at the predicted resonant frequency region, which can be readily shifted to higher frequencies by tuning the structural parameters. Improvement in bandwidth of the interconnect is demonstrated by using a pad with higher dielectric constant. Furthermore, it is also shown that a slight modification allows DC connection in addition to efficient coupling at the resonant frequency.
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Masashi HOTTA, Yongxi QIAN, Tatsuo ITOH, "A Novel Resonant Coupling Type Microstrip Line Interconnect" in IEICE TRANSACTIONS on Electronics,
vol. E82-C, no. 1, pp. 147-150, January 1999, doi: .
Abstract: Resonant coupling type microstrip line interconnects using a bonding ribbon and dielectric pad have been designed and fabricated. The basic concept of this interconnect is the LC serial resonance of the pad capacitor and ribbon inductor. Both numerical simulation and experiment reveal low return loss and high efficiency connection at the predicted resonant frequency region, which can be readily shifted to higher frequencies by tuning the structural parameters. Improvement in bandwidth of the interconnect is demonstrated by using a pad with higher dielectric constant. Furthermore, it is also shown that a slight modification allows DC connection in addition to efficient coupling at the resonant frequency.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e82-c_1_147/_p
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@ARTICLE{e82-c_1_147,
author={Masashi HOTTA, Yongxi QIAN, Tatsuo ITOH, },
journal={IEICE TRANSACTIONS on Electronics},
title={A Novel Resonant Coupling Type Microstrip Line Interconnect},
year={1999},
volume={E82-C},
number={1},
pages={147-150},
abstract={Resonant coupling type microstrip line interconnects using a bonding ribbon and dielectric pad have been designed and fabricated. The basic concept of this interconnect is the LC serial resonance of the pad capacitor and ribbon inductor. Both numerical simulation and experiment reveal low return loss and high efficiency connection at the predicted resonant frequency region, which can be readily shifted to higher frequencies by tuning the structural parameters. Improvement in bandwidth of the interconnect is demonstrated by using a pad with higher dielectric constant. Furthermore, it is also shown that a slight modification allows DC connection in addition to efficient coupling at the resonant frequency.},
keywords={},
doi={},
ISSN={},
month={January},}
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TY - JOUR
TI - A Novel Resonant Coupling Type Microstrip Line Interconnect
T2 - IEICE TRANSACTIONS on Electronics
SP - 147
EP - 150
AU - Masashi HOTTA
AU - Yongxi QIAN
AU - Tatsuo ITOH
PY - 1999
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E82-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 1999
AB - Resonant coupling type microstrip line interconnects using a bonding ribbon and dielectric pad have been designed and fabricated. The basic concept of this interconnect is the LC serial resonance of the pad capacitor and ribbon inductor. Both numerical simulation and experiment reveal low return loss and high efficiency connection at the predicted resonant frequency region, which can be readily shifted to higher frequencies by tuning the structural parameters. Improvement in bandwidth of the interconnect is demonstrated by using a pad with higher dielectric constant. Furthermore, it is also shown that a slight modification allows DC connection in addition to efficient coupling at the resonant frequency.
ER -