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Laser-SQUID Microscopy as a Novel Tool for Inspection, Monitoring and Analysis of LSI-Chip-Defects: Nondestructive and Non-electrical-contact Technique

Kiyoshi NIKAWA

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Summary :

We have developed and demonstrated a novel technique for electrical inspection and electrical failure analysis, which can detect open, high-resistance, and short circuits without the need for electrical contact with the outside of the LSI chip or the board on which the LSI chip is mounted. The basic idea of the technique is the detection of the magnetic field produced by OBIC (optical beam induced current) or photo current. A DC-SQUID (superconducting quantum interference device) magnetometer is used to detect the magnetic field. This scanning laser-SQUID microscopy ("laser-SQUID" for short) has a spatial resolution of about 1.3 µm. It can be used to distinguish defective chips before bonding pad patterning or after bonding without pin-selection. It can localize any defective site in the chip to within a few square microns.

Publication
IEICE TRANSACTIONS on Electronics Vol.E85-C No.3 pp.746-751
Publication Date
2002/03/01
Publicized
Online ISSN
DOI
Type of Manuscript
Special Section INVITED PAPER (Special Issue on Superconductive Electronics)
Category
Instruments and Coolers

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