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Open Access
High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices

Shigeru KANAZAWA, Hiroshi YAMAZAKI, Yuta UEDA, Wataru KOBAYASHI, Yoshihiro OGISO, Johsuke OZAKI, Takahiko SHINDO, Satoshi TSUNASHIMA, Hiromasa TANOBE, Atsushi ARARATAKE

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Summary :

We developed a high-frequency and integrated design based on a flip-chip interconnection technique (Hi-FIT) as a wire-free interconnection technique that provides a high modulation bandwidth. The Hi-FIT can be applied to various high-speed (>100 Gbaud) optical devices. The Hi-FIT EA-DFB laser module has a 3-dB bandwidth of 59 GHz. And with a 4-intensity-level pulse amplitude modulation (PAM) operation at 107 Gbaud, we obtained a bit-error rate (BER) of less than 3.8×10-3, which is an error-free condition, by using a 7%-overhead (OH) hard-decision forward error correction (HD-FEC) code, even after a 10-km SMF transmission. The 3-dB bandwidth of the Hi-FIT employing an InP-MZM sub-assembly was more than 67 GHz, which was the limit of our measuring instrument. We also demonstrated a 120-Gbaud rate IQ modulation.

Publication
IEICE TRANSACTIONS on Electronics Vol.E102-C No.4 pp.340-346
Publication Date
2019/04/01
Publicized
Online ISSN
1745-1353
DOI
10.1587/transele.2018ODI0001
Type of Manuscript
Special Section INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity)
Category

Authors

Shigeru KANAZAWA
  NTT Corporation
Hiroshi YAMAZAKI
  NTT Corporation
Yuta UEDA
  NTT Corporation
Wataru KOBAYASHI
  NTT Corporation
Yoshihiro OGISO
  NTT Corporation
Johsuke OZAKI
  NTT Corporation
Takahiko SHINDO
  NTT Corporation
Satoshi TSUNASHIMA
  NTT Corporation
Hiromasa TANOBE
  NTT Corporation
Atsushi ARARATAKE
  NTT Corporation

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