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Contact Pad Design Considerations for Semiconductor Qubit Devices for Reducing On-Chip Microwave Crosstalk

Kaito TOMARI, Jun YONEDA, Tetsuo KODERA

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Summary :

Reducing on-chip microwave crosstalk is crucial for semiconductor spin qubit integration. Toward crosstalk reduction and qubit integration, we investigate on-chip microwave crosstalk for gate electrode pad designs with (i) etched trenches between contact pads or (ii) contact pads with reduced sizes. We conclude that the design with feature (ii) is advantageous for high-density integration of semiconductor qubits with small crosstalk (below -25 dB at 6 GHz), favoring the introduction of flip-chip bonding.

Publication
IEICE TRANSACTIONS on Electronics Vol.E106-C No.10 pp.588-591
Publication Date
2023/10/01
Publicized
2023/02/20
Online ISSN
1745-1353
DOI
10.1587/transele.2022FUS0001
Type of Manuscript
BRIEF PAPER
Category

Authors

Kaito TOMARI
  Tokyo Institute of Technology,Nikon Corporation
Jun YONEDA
  Tokyo Institute of Technology
Tetsuo KODERA
  Tokyo Institute of Technology

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