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Device Modeling Techniques for High-Frequency Circuits Design Using Bond-Based Design at over 100 GHz

Ryuichi FUJIMOTO, Kyoya TAKANO, Mizuki MOTOYOSHI, Uroschanit YODPRASIT, Minoru FUJISHIMA

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Summary :

Device modeling techniques for high-frequency circuits operating at over 100 GHz are presented. We have proposed the bond-based design as an accurate high-frequency circuit design method. Because layout parasitic extractions (LPE) are not required in the bond-based design, it can be applied high-frequency circuit design at over 100 GHz. However, customized device models are indispensable for the bond-based design. In this paper, device modeling techniques for high-frequency circuit design using the bond-based design are proposed. The customized device model for MOSFETs, transmission lines and pads are introduced. By using customized device models, the difference between the simulated and measured gains of an amplifier is improved to less than 0.6 dB at 120 GHz.

Publication
IEICE TRANSACTIONS on Electronics Vol.E94-C No.4 pp.589-597
Publication Date
2011/04/01
Publicized
Online ISSN
1745-1353
DOI
10.1587/transele.E94.C.589
Type of Manuscript
Special Section PAPER (Special Section on Circuits and Design Techniques for Advanced Large Scale Integration)
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