We describe an application of InGaAs/AlGaAs VCSELs to multiple wavelength light source for optical interconnection. A flip-chip bonding technique is used to integrate the VCSELs lasing at different wavelengths. The integrated VCSELs of different wavelengths are individually grown and processed, so that one can optimize the device characteristics and the wavelength separation or distribution for multiple wavelength interconnection systems. A 9-wavelength VCSEL array with a wavelength separation of 5 nm has been successfully fabricated.

The VSTEP concept and its practical application in the form of an LED-type pnpn-VSTEP demonstrating low power consumption through electro-photonic operational modes are both shown. Further, with focus primarily on the new laser-mode VSTEP with high-intensity light output and narrow optical beam divergence, the design features such as threshold gain and optical absorptivity, device fabrication, and characteristics are explained. The possibility of ultimate performance based mainly on electrical to optical power conversion efficiency, important from the application viewpoint of optical interconnection, are also discussed. Also, as two examples of functional optical interconnection achieved by VSTEP, serial-to-parallel data conversion and optical self-routing switches are shown. Finally, future opto-electronic technologies to be developed for two-dimensionally integrable surface-type optical semiconductor devices, including the VSTEP, are discussed.

The VSTEP concept and its practical application in the form of an LED-type pnpn-VSTEP demonstrating low power consumption through electro-photonic operational modes are both shown. Further, with focus primarily on the new laser-mode VSTEP with high-intensity light output and narrow optical beam divergence, the design features such as threshold gain and optical absorptivity, device fabrication, and characteristics are explained. The possibility of ultimate performance based mainly on electrical to optical power conversion efficiency, important from the application viewpoint of optical interconnection, are also discussed. Also, as two examples of functional optical interconnection achieved by VSTEP, serial-to-parallel data conversion and optical self-routing switches are shown. Finally, future opto-electronic technologies to be developed for two-dimensionally integrable surface-type optical semiconductor devices, including the VSTEP, are discussed.