A press-fit connection is a solderless electrical connection technology, which utilizes the mechanical contact force generated between through-holes on a printed circuit board (PCB) and terminals with a width slightly larger than the through-hole diameter. This technology has been widely noted recently as a measure against the "Lead Free Requirement" of materials comprising electric/electronic devices, especially in the area of automobile connector. For the application of this technology to automobile connectors, we have to take into account the severe requirement, such as (1) the adaptation to wider through-hole diameter tolerance range and (2) the establishment of connection reliability for the various PCB surface treatments. As a result, we have determined the minimum and maximum contact forces satisfying the long term connection reliability and designed the terminal shape, which has been refined the N-shape cross section developed before, by using three dimensional finite element methods (FEM). Furthermore, we have developed a new type of hard tin plating on terminals, thus preventing the scraping-off of tin during the insertion process, that could result in a short-circuit on the PCB, for the Organic Solderability Preservative (OSP) treated PCB. The press-fit connector for the automobile airbag Electronic Control Units (ECUs) we developed has been able to transfer to the mass-production phase successfully from August 2005.

The reliability of a connector depends on the contact force generated by the spring in the terminal of a connector. The springs are commonly formed by stamping from a strip of spring material. Therefore, the prediction of the force — displacement relation by the finite element (FE) method is very important for the design of terminals. For simulation, an accurate model of stress-strain (s-s) responses of the materials is required. When the materials are deformed in the forward and then the reverse directions, almost all spring materials show different s-s responses between the two directions, due to the Bauschinger effect. This phenomenon makes simulation difficult because the s-s response depends on the prior deformation of the material. Hence, the measurement of the s-s response is the elementary process, by cyclic tension and compression testing in which materials deform elastically and plastically. Then, the s-s responses should be described accurately by mathematical models for FE simulation. In this paper, the authors compare the experimental s-s responses of copper-based materials with conventional mathematical models and the Yoshida-Uemori model, which is a constitutive model having high capability of describing the elastic and plastic behavior of cyclic deformation. The calculated s-s responses only by Yoshida-Uemori model were in very good agreement with the corresponding experimental results. Therefore, the use of this model for FE simulation would be recommended for a more accurate prediction of force-displacement relation of the spring.