Techniques of near-field magnetic measurement and their applications to EMC of digital equipment are described. Magnetic-field measurement near PCB or LSI is the mostly used technique to specify the source. This paper treats an example of board analysis by near-field magnetic measurement, the sensing mechanism and the structure of a loop probe, and a recent progress of this method and application. To establish appropriate design direction in high-speed and high-density packaging of electronic equipment, electromagnetic behavior in chip and package should be clarified. Expectation of development for measuring minute area is more and more increasing.