In order to achieve an efficient and reliable prediction of device performance by numerical device simulation, a discretization mesh must be generated with an adequate, but not redundant, density of mesh points. However, manual mesh optimization requires user's trial and error. This task annoys the user considerably, especially when the device operation is not well known, or the required mesh-point density strongly depends on the bias condition, or else the manipulation of the mesh is difficult as is expected in 3D. Since these situations often happen in designing advanced VLSI devices, it is highly desirable to automatically optimize the mesh. Adaptive meshing techniques realize automatic optimization by refining the mesh according to the discretization error estimated from the solution. The performance of mesh optimization depends on a posteriori error indicators adopted to evaluate the discretization error. In particular, to obtain a precise terminal-current value, a reliable error indicator for the current continuity equation is necessary. In this paper, adaptive meshing based on the current continuity equation is investigated. A heuristic error indicator is proposed, and a methodology to extend a theoretical error indicator proposed for the finite element method to the requirements of device simulation is presented. The theoretical indicator is based on the energy norm of the flux-density error and is applicable to both Poisson and current continuity equations regardless of the mesh-element shape. These error indicators have been incorporated into the adaptive-mesh device-simulator HFIELDS, and their practicality is examined by MOSFET simulation. Both indicators can produce a mesh with sufficient node density in the channel region, and precise drain current values are obtained on the optimized meshes. The theoretical indicator is superior because it provides a better optimization performance, and is applicable to general mesh elements.

In this paper, a "hydrodynamic" version of the three-dimensional code HFIELDS-3D is used to achieve a detailed knowledge on the distribution of the substrate current inside a recessed-oxide MOSFET. The physical model features a temperature-dependent formulation of the impact-ionization rate, allowing non-local effects to be accounted for. The discretization strategy relies on the Box Integration scheme and uses suitable generalizations of the Scharfetter-Gummel technique for the energy-balance equation. The simulation results show that the narrow-channel effect has a different impact on drain and substrate currents. Further three-dimensional effects, such as the extra heating of the carriers at the channel edge, are demonstrated.

In this paper, characteristics of a digital system dedicated to the fast execution of the FDTD algorithm, widely used for electromagnetic simulation, are presented. Such system is conceived as a module communicating with a host personal computer via a PCI bus, and is based on a VLSI ASIC, which implements the "field-update" engine. The system structure is defined by means of a hardware description language, allowing to keep high-level system specification independent of the actual fabrication technology. A virtual implementation of the system has been carried out, by mapping such description in a standard-cell style on a commercial 0.35 µm technology. Simulations show that significant speed-up can be achieved, with respect to state-of-the-art software implementations of the same algorithm.

In this paper, the formulation of unified transport model is reviewed along with its implementation in a three-dimensional device simulator. The model features an accurate description of the energy exchange among electrons, holes and lattice, and is therefore suitable for self-consistently simulating thermal effects and non-stationary phenomena, as well as their possible interactions. Despite the model complexity, it is shown that the computational effort required for its solution is reasonably close to more conventional approaches. Application examples are also given, in which both unipolar and bipolar devices are simulated, discussing the relative importance of different phenomena and highlighting the simultaneous occurrence of carrier and lattice heating.