As semiconductor device manufacturing technology evolves toward higher integration and reduced feature size, the gap between the defect level estimated at the design stage and that reported for fabricated devices has become wider, making it more difficult to control total manufacturing cost including test cost and cost for field failure. To estimate fault coverage more precisely considering occurrence probabilities of faults, we have proposed weighted fault coverage estimation based on critical area corresponding to each fault. Previously different fault models were handled separately; thus, pattern compression efficiency and runtime were not optimized. In this study, we propose a fast test pattern generation scheme that considers weighted bridge and open fault coverage in an integrated manner. The proposed scheme applies two-step test pattern generation, wherein test patterns generated at second step that target only bridge faults are reordered with a search window of fixed size, achieving O(n) computational complexity. Experimental results indicate that with 10% of the initial target fault size and a fixed, small window size, the proposed scheme achieves approximately 100 times runtime reduction when compared to simple greedy-based reordering, in exchange for about 5% pattern count increment.