In this paper, we propose a method to simulate the curve surface of the initial height in the movement of the electronic wire bonder using the experimental data. For given measured data (xk, yk, zk (k=1, 2, , m)), we propose an algebraic surface of n-th degree as a methematical model of the initial height surface. The AIC method is a method of evaluating the goodness of a given model. The maximum likelihood model is selected by comparing with the AIC value of each model for n=0, 1, 2, 3, , 11. Useing this model, the initial raise position of the electronic wire bonder can be controlled by computer programing and can make the movement of wire bonder full-automatic. As a resurt, the well-arranged wiring and reliable contacting can be obtained.