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IEICE TRANSACTIONS on Communications

Reconfigurable Metal Chassis Antenna

Chi-Yuk CHIU, Shanpu SHEN, Fan JIANG, Katsunori ISHIMIYA, Qingsha S. CHENG, Ross D. MURCH

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Summary :

Smartphones for wireless communication typically consist of a large area frontal liquid crystal display (LCD), which incorporates a metal back plate, and a back cover chassis made from metal. Leveraging this structure a new approach to construct antennas for smartphones is proposed where the complete metal back cover chassis and LCD back plate are used as the radiating element and ground plane. In the design a feedline is connected between the metal back cover chassis and LCD back plate, along with shorts at various locations between the two metal plates, to control the resonance frequency of the resulting antenna. Multiple-band operation is possible without the need for any slots in the plates for radiation. Results show that antenna frequency reconfigurability can be achieved when switching function is added to the shorts so that several wireless communication bands can be covered. This approach is different from existing metallic frame antenna designs currently available in the market. A design example is provided which uses one PIN diode for the switching shorts and the target frequency bands are 740-780MHz and 900-1000MHz & 1700-1900MHz. The optimization of LC matchings and concerns of hand effects and metallic components between the chassis and LCD metal back plate are also addressed.

Publication
IEICE TRANSACTIONS on Communications Vol.E102-B No.1 pp.147-155
Publication Date
2019/01/01
Publicized
2018/07/17
Online ISSN
1745-1345
DOI
10.1587/transcom.2018EBP3123
Type of Manuscript
PAPER
Category
Antennas and Propagation

Authors

Chi-Yuk CHIU
  Hong Kong University of Science and Technology
Shanpu SHEN
  Hong Kong University of Science and Technology
Fan JIANG
  Hong Kong University of Science and Technology
Katsunori ISHIMIYA
  Goertek Technology Japan Co., Ltd.
Qingsha S. CHENG
  Southern University of Science and Technology
Ross D. MURCH
  Hong Kong University of Science and Technology

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