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IEICE TRANSACTIONS on Electronics

Novel Stacked Packaging Structure Using Silica-Based PLC with Integrated Micro-Mirrors and Its Application to 8ch PD Array Module

Ikuo OGAWA, Makoto ABE, Yoshiyuki DOI, Senichi SUZUKI

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Summary :

We propose and demonstrate a new stacked packaging structure using silica-based planar lightwave circuits (PLCs) with integrated micro-mirrors. This structure enables us to integrate active devices on PLCs with certain flexibility as regards optical coupling design and device selection. To achieve this, we developed an integrated micro-mirror with an accurate reflection angle and shielding structures to prevent crosstalk, and successfully demonstrated an 8-channel photodiode array module with excellent characteristics consisting of a high responsivity of > 0.85 A/W and a low crosstalk of < -65 dB.

Publication
IEICE TRANSACTIONS on Electronics Vol.E88-C No.8 pp.1552-1558
Publication Date
2005/08/01
Publicized
Online ISSN
DOI
10.1093/ietele/e88-c.8.1552
Type of Manuscript
Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices--Selected Papers from International Session on Electro-Mechanical Devices 2004 (IS-EMD2004)--)
Category
Optical Interconnection

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