IEICE TRANSACTIONS on Electronics
Novel MMIC Transmission Lines Using Thin Dielectric Layers
Summary :
Novel transmission line structures for multilayer MMICs, which are constructed with thin dielectric layers on a GaAs wafer surface, are theoretically and experimentally investigated. Five thin film transmission line structures are discussed in this paper: (1) Microstrip lines, (2) Inverted microstrip lines, (3) Triplate lines, (4) Trapezoidal microstrip lines and (5) Valley microstrip lines. These transmission line structures are fabricated using thin polyimide films and chemical etching.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E75-C No.6 pp.713-720
- Publication Date
- 1992/06/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section PAPER (Special Issue on MMIC Technology)
- Category
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Seiichi BANBA, Takao HASEGAWA, Hiroyo OGAWA, Tsuneo TOKUMITSU, "Novel MMIC Transmission Lines Using Thin Dielectric Layers" in IEICE TRANSACTIONS on Electronics,
vol. E75-C, no. 6, pp. 713-720, June 1992, doi: .
Abstract: Novel transmission line structures for multilayer MMICs, which are constructed with thin dielectric layers on a GaAs wafer surface, are theoretically and experimentally investigated. Five thin film transmission line structures are discussed in this paper: (1) Microstrip lines, (2) Inverted microstrip lines, (3) Triplate lines, (4) Trapezoidal microstrip lines and (5) Valley microstrip lines. These transmission line structures are fabricated using thin polyimide films and chemical etching.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e75-c_6_713/_p
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@ARTICLE{e75-c_6_713,
author={Seiichi BANBA, Takao HASEGAWA, Hiroyo OGAWA, Tsuneo TOKUMITSU, },
journal={IEICE TRANSACTIONS on Electronics},
title={Novel MMIC Transmission Lines Using Thin Dielectric Layers},
year={1992},
volume={E75-C},
number={6},
pages={713-720},
abstract={Novel transmission line structures for multilayer MMICs, which are constructed with thin dielectric layers on a GaAs wafer surface, are theoretically and experimentally investigated. Five thin film transmission line structures are discussed in this paper: (1) Microstrip lines, (2) Inverted microstrip lines, (3) Triplate lines, (4) Trapezoidal microstrip lines and (5) Valley microstrip lines. These transmission line structures are fabricated using thin polyimide films and chemical etching.},
keywords={},
doi={},
ISSN={},
month={June},}
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TY - JOUR
TI - Novel MMIC Transmission Lines Using Thin Dielectric Layers
T2 - IEICE TRANSACTIONS on Electronics
SP - 713
EP - 720
AU - Seiichi BANBA
AU - Takao HASEGAWA
AU - Hiroyo OGAWA
AU - Tsuneo TOKUMITSU
PY - 1992
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E75-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 1992
AB - Novel transmission line structures for multilayer MMICs, which are constructed with thin dielectric layers on a GaAs wafer surface, are theoretically and experimentally investigated. Five thin film transmission line structures are discussed in this paper: (1) Microstrip lines, (2) Inverted microstrip lines, (3) Triplate lines, (4) Trapezoidal microstrip lines and (5) Valley microstrip lines. These transmission line structures are fabricated using thin polyimide films and chemical etching.
ER -
English
