An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filter for Mobile Communication
Summary :
We applied a filip-chip-bonding technique to GHz-band SAW filters. The SAW filters mounted by the stud-bump-bonding (SBB) technique which is a kind of flip-chip-bonding technique showed almost the same frequency characteristics as those mounted by the conventional wire-bonding technique at 1.5 GHz. The SAW filter configuration, fabrication process using the SBB, and its electrical characteristics are described and discussed. The SBB technique has a lot of potential to reduce the size and weight even above GHz frequencies.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E76-C No.6 pp.993-999
- Publication Date
- 1993/06/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functions and Size-Reductions)
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Keiji ONISHI, Shun-ichi SEKI, Yutaka TAGUCHI, Yoshihiro BESSHO, Kazuo EDA, Toru ISHIDA, "An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filter for Mobile Communication" in IEICE TRANSACTIONS on Electronics,
vol. E76-C, no. 6, pp. 993-999, June 1993, doi: .
Abstract: We applied a filip-chip-bonding technique to GHz-band SAW filters. The SAW filters mounted by the stud-bump-bonding (SBB) technique which is a kind of flip-chip-bonding technique showed almost the same frequency characteristics as those mounted by the conventional wire-bonding technique at 1.5 GHz. The SAW filter configuration, fabrication process using the SBB, and its electrical characteristics are described and discussed. The SBB technique has a lot of potential to reduce the size and weight even above GHz frequencies.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e76-c_6_993/_p
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@ARTICLE{e76-c_6_993,
author={Keiji ONISHI, Shun-ichi SEKI, Yutaka TAGUCHI, Yoshihiro BESSHO, Kazuo EDA, Toru ISHIDA, },
journal={IEICE TRANSACTIONS on Electronics},
title={An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filter for Mobile Communication},
year={1993},
volume={E76-C},
number={6},
pages={993-999},
abstract={We applied a filip-chip-bonding technique to GHz-band SAW filters. The SAW filters mounted by the stud-bump-bonding (SBB) technique which is a kind of flip-chip-bonding technique showed almost the same frequency characteristics as those mounted by the conventional wire-bonding technique at 1.5 GHz. The SAW filter configuration, fabrication process using the SBB, and its electrical characteristics are described and discussed. The SBB technique has a lot of potential to reduce the size and weight even above GHz frequencies.},
keywords={},
doi={},
ISSN={},
month={June},}
Copy
TY - JOUR
TI - An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filter for Mobile Communication
T2 - IEICE TRANSACTIONS on Electronics
SP - 993
EP - 999
AU - Keiji ONISHI
AU - Shun-ichi SEKI
AU - Yutaka TAGUCHI
AU - Yoshihiro BESSHO
AU - Kazuo EDA
AU - Toru ISHIDA
PY - 1993
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E76-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 1993
AB - We applied a filip-chip-bonding technique to GHz-band SAW filters. The SAW filters mounted by the stud-bump-bonding (SBB) technique which is a kind of flip-chip-bonding technique showed almost the same frequency characteristics as those mounted by the conventional wire-bonding technique at 1.5 GHz. The SAW filter configuration, fabrication process using the SBB, and its electrical characteristics are described and discussed. The SBB technique has a lot of potential to reduce the size and weight even above GHz frequencies.
ER -
English
