Technical Trends on Electromechanical Devices
Summary :
Electromechanical devices such as relays, switches, connectors and printed wiring boards have shown quick growth along with remarkable progress of electronic products in a recent few decades. For the present, outstanding tasks common to these devices are further downsizing, higher density and broading of bandwidth, on the assumption of keeping high performance and high reliability. These tasks are realized by part production improvement for higher precision and automatic assemblies, development of constituent materials and development of breakthrough structural technologies such as a surface mount technology and an active assembly ferrule technology in optical connectors and so on. In this paper, the technical trends as well as the motive technologies are overviewed for each device.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E77-C No.10 pp.1536-1544
- Publication Date
- 1994/10/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section INVITED PAPER (Special Issue on Recent Electromechanical Devices)
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Takeshi AOKI, Yasuhisa NISHIMURA, "Technical Trends on Electromechanical Devices" in IEICE TRANSACTIONS on Electronics,
vol. E77-C, no. 10, pp. 1536-1544, October 1994, doi: .
Abstract: Electromechanical devices such as relays, switches, connectors and printed wiring boards have shown quick growth along with remarkable progress of electronic products in a recent few decades. For the present, outstanding tasks common to these devices are further downsizing, higher density and broading of bandwidth, on the assumption of keeping high performance and high reliability. These tasks are realized by part production improvement for higher precision and automatic assemblies, development of constituent materials and development of breakthrough structural technologies such as a surface mount technology and an active assembly ferrule technology in optical connectors and so on. In this paper, the technical trends as well as the motive technologies are overviewed for each device.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e77-c_10_1536/_p
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@ARTICLE{e77-c_10_1536,
author={Takeshi AOKI, Yasuhisa NISHIMURA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Technical Trends on Electromechanical Devices},
year={1994},
volume={E77-C},
number={10},
pages={1536-1544},
abstract={Electromechanical devices such as relays, switches, connectors and printed wiring boards have shown quick growth along with remarkable progress of electronic products in a recent few decades. For the present, outstanding tasks common to these devices are further downsizing, higher density and broading of bandwidth, on the assumption of keeping high performance and high reliability. These tasks are realized by part production improvement for higher precision and automatic assemblies, development of constituent materials and development of breakthrough structural technologies such as a surface mount technology and an active assembly ferrule technology in optical connectors and so on. In this paper, the technical trends as well as the motive technologies are overviewed for each device.},
keywords={},
doi={},
ISSN={},
month={October},}
Copy
TY - JOUR
TI - Technical Trends on Electromechanical Devices
T2 - IEICE TRANSACTIONS on Electronics
SP - 1536
EP - 1544
AU - Takeshi AOKI
AU - Yasuhisa NISHIMURA
PY - 1994
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E77-C
IS - 10
JA - IEICE TRANSACTIONS on Electronics
Y1 - October 1994
AB - Electromechanical devices such as relays, switches, connectors and printed wiring boards have shown quick growth along with remarkable progress of electronic products in a recent few decades. For the present, outstanding tasks common to these devices are further downsizing, higher density and broading of bandwidth, on the assumption of keeping high performance and high reliability. These tasks are realized by part production improvement for higher precision and automatic assemblies, development of constituent materials and development of breakthrough structural technologies such as a surface mount technology and an active assembly ferrule technology in optical connectors and so on. In this paper, the technical trends as well as the motive technologies are overviewed for each device.
ER -
English
