Contact Resistance between Plated Conductors and Current Density Distribution in a Contact Spot
Summary :
Plating is applied to protect contact surfaces of contact devices such as switch, relay and connector from contaminations of oxidization and sulfuration etc. Furthermore it is known that the contact resistance can be reduced when there exist plated layers on the contact surfaces which have enough thickness and low resistivity compared with substratum materials. In this paper, contact resistance between plated conductors are calculated using three dimensional finite element method. Similariry, current density distribution in a contact spot with various resistivity of plated layers are shown and relative conductance depends on the contact area fraction with thickness of plated layers are presented.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E77-C No.10 pp.1592-1596
- Publication Date
- 1994/10/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section PAPER (Special Issue on Recent Electromechanical Devices)
- Category
- Simulation and AI-Technology
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Isao MINOWA, Mitsunobu NAKAMURA, "Contact Resistance between Plated Conductors and Current Density Distribution in a Contact Spot" in IEICE TRANSACTIONS on Electronics,
vol. E77-C, no. 10, pp. 1592-1596, October 1994, doi: .
Abstract: Plating is applied to protect contact surfaces of contact devices such as switch, relay and connector from contaminations of oxidization and sulfuration etc. Furthermore it is known that the contact resistance can be reduced when there exist plated layers on the contact surfaces which have enough thickness and low resistivity compared with substratum materials. In this paper, contact resistance between plated conductors are calculated using three dimensional finite element method. Similariry, current density distribution in a contact spot with various resistivity of plated layers are shown and relative conductance depends on the contact area fraction with thickness of plated layers are presented.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e77-c_10_1592/_p
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@ARTICLE{e77-c_10_1592,
author={Isao MINOWA, Mitsunobu NAKAMURA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Contact Resistance between Plated Conductors and Current Density Distribution in a Contact Spot},
year={1994},
volume={E77-C},
number={10},
pages={1592-1596},
abstract={Plating is applied to protect contact surfaces of contact devices such as switch, relay and connector from contaminations of oxidization and sulfuration etc. Furthermore it is known that the contact resistance can be reduced when there exist plated layers on the contact surfaces which have enough thickness and low resistivity compared with substratum materials. In this paper, contact resistance between plated conductors are calculated using three dimensional finite element method. Similariry, current density distribution in a contact spot with various resistivity of plated layers are shown and relative conductance depends on the contact area fraction with thickness of plated layers are presented.},
keywords={},
doi={},
ISSN={},
month={October},}
Copy
TY - JOUR
TI - Contact Resistance between Plated Conductors and Current Density Distribution in a Contact Spot
T2 - IEICE TRANSACTIONS on Electronics
SP - 1592
EP - 1596
AU - Isao MINOWA
AU - Mitsunobu NAKAMURA
PY - 1994
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E77-C
IS - 10
JA - IEICE TRANSACTIONS on Electronics
Y1 - October 1994
AB - Plating is applied to protect contact surfaces of contact devices such as switch, relay and connector from contaminations of oxidization and sulfuration etc. Furthermore it is known that the contact resistance can be reduced when there exist plated layers on the contact surfaces which have enough thickness and low resistivity compared with substratum materials. In this paper, contact resistance between plated conductors are calculated using three dimensional finite element method. Similariry, current density distribution in a contact spot with various resistivity of plated layers are shown and relative conductance depends on the contact area fraction with thickness of plated layers are presented.
ER -
English
