Analysis of Bonding State in Clad Contact Using Ultrasonic Microscope

Takeshi SUZUKI; Masayuki NODA

Analysis of Bonding State in Clad Contact Using Ultrasonic Microscope

Takeshi SUZUKI, Masayuki NODA

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In clad contacts of bonded dissimilar metals used in relays and switches, the bonding state affects the switching performance of those devices. Examining the bonding state and analyzing the relationship between the bonding state and the causes of malfunction, such as welding of the contact, leads to improvement in reliability of electromechanical devices. In this experiment we examined, with an ultrasonic microscope, the bonding state in riveted clad contacts which had been subjected to load-breaks of in-rush current, and were able to demonstrate the causal relation of the bonding state with malfunctions of the contacts. The use of the ultrasonic microscope made it possible to perform a hitherto difficult detailed analysis of the bonding state of clad contacts. It was also confirmed that this was an extremely effective method for studying the relationship with switching performance.

Publication: IEICE TRANSACTIONS on Electronics Vol.E77-C No.10 pp.1621-1626

Publication Date: 1994/10/25

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Type of Manuscript: Special Section PAPER (Special Issue on Recent Electromechanical Devices)

Category: Contact Reliability

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Takeshi SUZUKI, Masayuki NODA, "Analysis of Bonding State in Clad Contact Using Ultrasonic Microscope" in IEICE TRANSACTIONS on Electronics, vol. E77-C, no. 10, pp. 1621-1626, October 1994, doi: .
Abstract: In clad contacts of bonded dissimilar metals used in relays and switches, the bonding state affects the switching performance of those devices. Examining the bonding state and analyzing the relationship between the bonding state and the causes of malfunction, such as welding of the contact, leads to improvement in reliability of electromechanical devices. In this experiment we examined, with an ultrasonic microscope, the bonding state in riveted clad contacts which had been subjected to load-breaks of in-rush current, and were able to demonstrate the causal relation of the bonding state with malfunctions of the contacts. The use of the ultrasonic microscope made it possible to perform a hitherto difficult detailed analysis of the bonding state of clad contacts. It was also confirmed that this was an extremely effective method for studying the relationship with switching performance.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e77-c_10_1621/_p

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@ARTICLE{e77-c_10_1621,
author={Takeshi SUZUKI, Masayuki NODA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Analysis of Bonding State in Clad Contact Using Ultrasonic Microscope},
year={1994},
volume={E77-C},
number={10},
pages={1621-1626},
abstract={In clad contacts of bonded dissimilar metals used in relays and switches, the bonding state affects the switching performance of those devices. Examining the bonding state and analyzing the relationship between the bonding state and the causes of malfunction, such as welding of the contact, leads to improvement in reliability of electromechanical devices. In this experiment we examined, with an ultrasonic microscope, the bonding state in riveted clad contacts which had been subjected to load-breaks of in-rush current, and were able to demonstrate the causal relation of the bonding state with malfunctions of the contacts. The use of the ultrasonic microscope made it possible to perform a hitherto difficult detailed analysis of the bonding state of clad contacts. It was also confirmed that this was an extremely effective method for studying the relationship with switching performance.},
keywords={},
doi={},
ISSN={},
month={October},}

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TY - JOUR
TI - Analysis of Bonding State in Clad Contact Using Ultrasonic Microscope
T2 - IEICE TRANSACTIONS on Electronics
SP - 1621
EP - 1626
AU - Takeshi SUZUKI
AU - Masayuki NODA
PY - 1994
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E77-C
IS - 10
JA - IEICE TRANSACTIONS on Electronics
Y1 - October 1994
AB - In clad contacts of bonded dissimilar metals used in relays and switches, the bonding state affects the switching performance of those devices. Examining the bonding state and analyzing the relationship between the bonding state and the causes of malfunction, such as welding of the contact, leads to improvement in reliability of electromechanical devices. In this experiment we examined, with an ultrasonic microscope, the bonding state in riveted clad contacts which had been subjected to load-breaks of in-rush current, and were able to demonstrate the causal relation of the bonding state with malfunctions of the contacts. The use of the ultrasonic microscope made it possible to perform a hitherto difficult detailed analysis of the bonding state of clad contacts. It was also confirmed that this was an extremely effective method for studying the relationship with switching performance.
ER -