A Study of the Relationship between Contact Materials and Sticking Characteristics on Telecommunication Relay

Hideki IWATA; Toshio OHYA; Shoji MITSUISHI; Hiroki MARUYAMA

A Study of the Relationship between Contact Materials and Sticking Characteristics on Telecommunication Relay

Hideki IWATA, Toshio OHYA, Shoji MITSUISHI, Hiroki MARUYAMA

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In this paper, the relationship between contact materials and sticking characteristics, and stability of contact resistance to obtain excellent contacts for telecommunication relays, is studied. The contact switching current for telecommunication relay is low. Moreover, contact force and opening force in these relay are respectively several mN. Nine kinds of contact materials are selected as a experimental factor. They are Ag, Ag-Ni (Ni: 0.03 to 20%), Ag-Cu 10%, Ag-Pd 60% and Pd-Ru 10%, and are overlaid with gold except Pd-Ru 10%. In this study, contact life tests on a commercial ultra-miniature telecommunication relay by mounting above-mentioned contacts are conducted. The sticking and the contact resistance are monitored at each switching operation in the contact life test. After the life test, the contact surfaces are observed, and the depth of crater, the height of pip and projected concave area are measured, then the relationship between the sticking morphologies and the composition of each material are studied. As the result of this study, the contact sticking of telecommunication rely is assumed to be the result of mechanical locking, and the effects of the Ni content in the Ag-Ni contacts is clarified. Moreover, it is confirmed that the effects of opening force on the sticking characteristics are remarkable.

Publication: IEICE TRANSACTIONS on Electronics Vol.E77-C No.10 pp.1627-1633

Publication Date: 1994/10/25

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Type of Manuscript: Special Section PAPER (Special Issue on Recent Electromechanical Devices)

Category: Contact Reliability

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Hideki IWATA, Toshio OHYA, Shoji MITSUISHI, Hiroki MARUYAMA, "A Study of the Relationship between Contact Materials and Sticking Characteristics on Telecommunication Relay" in IEICE TRANSACTIONS on Electronics, vol. E77-C, no. 10, pp. 1627-1633, October 1994, doi: .
Abstract: In this paper, the relationship between contact materials and sticking characteristics, and stability of contact resistance to obtain excellent contacts for telecommunication relays, is studied. The contact switching current for telecommunication relay is low. Moreover, contact force and opening force in these relay are respectively several mN. Nine kinds of contact materials are selected as a experimental factor. They are Ag, Ag-Ni (Ni: 0.03 to 20%), Ag-Cu 10%, Ag-Pd 60% and Pd-Ru 10%, and are overlaid with gold except Pd-Ru 10%. In this study, contact life tests on a commercial ultra-miniature telecommunication relay by mounting above-mentioned contacts are conducted. The sticking and the contact resistance are monitored at each switching operation in the contact life test. After the life test, the contact surfaces are observed, and the depth of crater, the height of pip and projected concave area are measured, then the relationship between the sticking morphologies and the composition of each material are studied. As the result of this study, the contact sticking of telecommunication rely is assumed to be the result of mechanical locking, and the effects of the Ni content in the Ag-Ni contacts is clarified. Moreover, it is confirmed that the effects of opening force on the sticking characteristics are remarkable.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e77-c_10_1627/_p

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@ARTICLE{e77-c_10_1627,
author={Hideki IWATA, Toshio OHYA, Shoji MITSUISHI, Hiroki MARUYAMA, },
journal={IEICE TRANSACTIONS on Electronics},
title={A Study of the Relationship between Contact Materials and Sticking Characteristics on Telecommunication Relay},
year={1994},
volume={E77-C},
number={10},
pages={1627-1633},
abstract={In this paper, the relationship between contact materials and sticking characteristics, and stability of contact resistance to obtain excellent contacts for telecommunication relays, is studied. The contact switching current for telecommunication relay is low. Moreover, contact force and opening force in these relay are respectively several mN. Nine kinds of contact materials are selected as a experimental factor. They are Ag, Ag-Ni (Ni: 0.03 to 20%), Ag-Cu 10%, Ag-Pd 60% and Pd-Ru 10%, and are overlaid with gold except Pd-Ru 10%. In this study, contact life tests on a commercial ultra-miniature telecommunication relay by mounting above-mentioned contacts are conducted. The sticking and the contact resistance are monitored at each switching operation in the contact life test. After the life test, the contact surfaces are observed, and the depth of crater, the height of pip and projected concave area are measured, then the relationship between the sticking morphologies and the composition of each material are studied. As the result of this study, the contact sticking of telecommunication rely is assumed to be the result of mechanical locking, and the effects of the Ni content in the Ag-Ni contacts is clarified. Moreover, it is confirmed that the effects of opening force on the sticking characteristics are remarkable.},
keywords={},
doi={},
ISSN={},
month={October},}

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TY - JOUR
TI - A Study of the Relationship between Contact Materials and Sticking Characteristics on Telecommunication Relay
T2 - IEICE TRANSACTIONS on Electronics
SP - 1627
EP - 1633
AU - Hideki IWATA
AU - Toshio OHYA
AU - Shoji MITSUISHI
AU - Hiroki MARUYAMA
PY - 1994
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E77-C
IS - 10
JA - IEICE TRANSACTIONS on Electronics
Y1 - October 1994
AB - In this paper, the relationship between contact materials and sticking characteristics, and stability of contact resistance to obtain excellent contacts for telecommunication relays, is studied. The contact switching current for telecommunication relay is low. Moreover, contact force and opening force in these relay are respectively several mN. Nine kinds of contact materials are selected as a experimental factor. They are Ag, Ag-Ni (Ni: 0.03 to 20%), Ag-Cu 10%, Ag-Pd 60% and Pd-Ru 10%, and are overlaid with gold except Pd-Ru 10%. In this study, contact life tests on a commercial ultra-miniature telecommunication relay by mounting above-mentioned contacts are conducted. The sticking and the contact resistance are monitored at each switching operation in the contact life test. After the life test, the contact surfaces are observed, and the depth of crater, the height of pip and projected concave area are measured, then the relationship between the sticking morphologies and the composition of each material are studied. As the result of this study, the contact sticking of telecommunication rely is assumed to be the result of mechanical locking, and the effects of the Ni content in the Ag-Ni contacts is clarified. Moreover, it is confirmed that the effects of opening force on the sticking characteristics are remarkable.
ER -