Interconnection of Solder-Plated Copper Strips to Thin-Film Gold Wiring
Summary :
Copper strips plated with Sn-Pb eutectic solder were hot pressure-bonded to gold thin-film wiring. It was proven that a Au-Sn alloy forms at the interconnection between the gold thin film and the copper strip, but that there is virtually no Pb present in the interconnection. Au, Sn, and Pb were observed on the surfaces of the copper strips and the gold thin film outside of the connection area.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E79-C No.8 pp.1177-1179
- Publication Date
- 1996/08/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- LETTER
- Category
- Components
Authors
Keyword
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Susumu SHIBATA, Masaru KIMURA, "Interconnection of Solder-Plated Copper Strips to Thin-Film Gold Wiring" in IEICE TRANSACTIONS on Electronics,
vol. E79-C, no. 8, pp. 1177-1179, August 1996, doi: .
Abstract: Copper strips plated with Sn-Pb eutectic solder were hot pressure-bonded to gold thin-film wiring. It was proven that a Au-Sn alloy forms at the interconnection between the gold thin film and the copper strip, but that there is virtually no Pb present in the interconnection. Au, Sn, and Pb were observed on the surfaces of the copper strips and the gold thin film outside of the connection area.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e79-c_8_1177/_p
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@ARTICLE{e79-c_8_1177,
author={Susumu SHIBATA, Masaru KIMURA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Interconnection of Solder-Plated Copper Strips to Thin-Film Gold Wiring},
year={1996},
volume={E79-C},
number={8},
pages={1177-1179},
abstract={Copper strips plated with Sn-Pb eutectic solder were hot pressure-bonded to gold thin-film wiring. It was proven that a Au-Sn alloy forms at the interconnection between the gold thin film and the copper strip, but that there is virtually no Pb present in the interconnection. Au, Sn, and Pb were observed on the surfaces of the copper strips and the gold thin film outside of the connection area.},
keywords={},
doi={},
ISSN={},
month={August},}
Copy
TY - JOUR
TI - Interconnection of Solder-Plated Copper Strips to Thin-Film Gold Wiring
T2 - IEICE TRANSACTIONS on Electronics
SP - 1177
EP - 1179
AU - Susumu SHIBATA
AU - Masaru KIMURA
PY - 1996
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E79-C
IS - 8
JA - IEICE TRANSACTIONS on Electronics
Y1 - August 1996
AB - Copper strips plated with Sn-Pb eutectic solder were hot pressure-bonded to gold thin-film wiring. It was proven that a Au-Sn alloy forms at the interconnection between the gold thin film and the copper strip, but that there is virtually no Pb present in the interconnection. Au, Sn, and Pb were observed on the surfaces of the copper strips and the gold thin film outside of the connection area.
ER -
English
