IEICE TRANSACTIONS on Electronics
Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method
Summary :
The present paper describes a novel approach to interconnecting and assembling components of MEMS at room temperature. The main drawback of the conventional bonding methods is their rather high process temperatures. The new method, which is referred as the surface activated bonding (SAB), utilizes the phenomena of the adhesion between two atomically clean solid surfaces to enable the bonding at lower temperature or even at room temperature. In the bonding procedure, the surfaces to be bonded are merely brought into contact after sputter-cleaning by Ar fast atom in ultrahigh vacuum conditions. TEM observations of the bonded interfaces show that a direct bonding in atomic scale is achieved in the interface between the micro-components. Based on the concept of this new bonding technology, a micro-assembly system was developed. The micro-assembly system is operated by means of a virtual manipulation system in which 3D model of the micro-components are manipulated virtually in a computer graphics constructed in the world wide web (WWW) scheme. The micro-assembly system will provide a new design tool of three dimensional MEMS by combining the possibility of the flexible assembly and the intuitive operations.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E80-C No.2 pp.297-302
- Publication Date
- 1997/02/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section PAPER (Special Issue on Micromachine Technology)
- Category
- Fabrication
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Tadatomo SUGA, Yuzo ISHII, Naoe HOSODA, "Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method" in IEICE TRANSACTIONS on Electronics,
vol. E80-C, no. 2, pp. 297-302, February 1997, doi: .
Abstract: The present paper describes a novel approach to interconnecting and assembling components of MEMS at room temperature. The main drawback of the conventional bonding methods is their rather high process temperatures. The new method, which is referred as the surface activated bonding (SAB), utilizes the phenomena of the adhesion between two atomically clean solid surfaces to enable the bonding at lower temperature or even at room temperature. In the bonding procedure, the surfaces to be bonded are merely brought into contact after sputter-cleaning by Ar fast atom in ultrahigh vacuum conditions. TEM observations of the bonded interfaces show that a direct bonding in atomic scale is achieved in the interface between the micro-components. Based on the concept of this new bonding technology, a micro-assembly system was developed. The micro-assembly system is operated by means of a virtual manipulation system in which 3D model of the micro-components are manipulated virtually in a computer graphics constructed in the world wide web (WWW) scheme. The micro-assembly system will provide a new design tool of three dimensional MEMS by combining the possibility of the flexible assembly and the intuitive operations.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e80-c_2_297/_p
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@ARTICLE{e80-c_2_297,
author={Tadatomo SUGA, Yuzo ISHII, Naoe HOSODA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method},
year={1997},
volume={E80-C},
number={2},
pages={297-302},
abstract={The present paper describes a novel approach to interconnecting and assembling components of MEMS at room temperature. The main drawback of the conventional bonding methods is their rather high process temperatures. The new method, which is referred as the surface activated bonding (SAB), utilizes the phenomena of the adhesion between two atomically clean solid surfaces to enable the bonding at lower temperature or even at room temperature. In the bonding procedure, the surfaces to be bonded are merely brought into contact after sputter-cleaning by Ar fast atom in ultrahigh vacuum conditions. TEM observations of the bonded interfaces show that a direct bonding in atomic scale is achieved in the interface between the micro-components. Based on the concept of this new bonding technology, a micro-assembly system was developed. The micro-assembly system is operated by means of a virtual manipulation system in which 3D model of the micro-components are manipulated virtually in a computer graphics constructed in the world wide web (WWW) scheme. The micro-assembly system will provide a new design tool of three dimensional MEMS by combining the possibility of the flexible assembly and the intuitive operations.},
keywords={},
doi={},
ISSN={},
month={February},}
Copy
TY - JOUR
TI - Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method
T2 - IEICE TRANSACTIONS on Electronics
SP - 297
EP - 302
AU - Tadatomo SUGA
AU - Yuzo ISHII
AU - Naoe HOSODA
PY - 1997
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E80-C
IS - 2
JA - IEICE TRANSACTIONS on Electronics
Y1 - February 1997
AB - The present paper describes a novel approach to interconnecting and assembling components of MEMS at room temperature. The main drawback of the conventional bonding methods is their rather high process temperatures. The new method, which is referred as the surface activated bonding (SAB), utilizes the phenomena of the adhesion between two atomically clean solid surfaces to enable the bonding at lower temperature or even at room temperature. In the bonding procedure, the surfaces to be bonded are merely brought into contact after sputter-cleaning by Ar fast atom in ultrahigh vacuum conditions. TEM observations of the bonded interfaces show that a direct bonding in atomic scale is achieved in the interface between the micro-components. Based on the concept of this new bonding technology, a micro-assembly system was developed. The micro-assembly system is operated by means of a virtual manipulation system in which 3D model of the micro-components are manipulated virtually in a computer graphics constructed in the world wide web (WWW) scheme. The micro-assembly system will provide a new design tool of three dimensional MEMS by combining the possibility of the flexible assembly and the intuitive operations.
ER -
English
