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Metal-Glazed Thick-Film Resistors Fired at Low Temperature on Glass Substrate

Ikuo KANEKO, Sadayoshi TAGUCHI, Toshiyuki KASHIWAGI

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Summary :

Conventional metal-glazed thick-film resistors are applied to Hybrid Integrated Circuits, chip resistors and others. These resistors are usually fired at a high temperature of around 850C on ceramic substrates. Recently, however, attempts have been made to fire some metal-glazed thick-film resistors at lower temperatures on glass substrates for application as the control resistors for the discharge current of dc Plasma Display Panels (PDPs). We have attempted to realize such low-firing-temperature thick-film resistors using Pb2Ru2O7-x as conductive particles, two kinds of lead-borosilicate glasses as binders, and three kinds of metallic oxide as additives, which are fired at 580C on a soda lime glass substrate. The electrical properties of the specimens, 16 kinds in all, fabricated from various combinations of binder glasses, additives and electrode materials have been measured. Effective dimensions of the specimen resistor are 0.25 0.25 mm2 or less in surface area, since extremely small size is required by PDPs. The effect of the combination of additive and binder glass on the conductive particles of Pb2Ru2O7-x has been examined in detail, together with the affinity for electrical conjunction between resistor and electrode.

Publication
IEICE TRANSACTIONS on Electronics Vol.E83-C No.10 pp.1669-1676
Publication Date
2000/10/25
Publicized
Online ISSN
DOI
Type of Manuscript
PAPER
Category
Electronic Components

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