3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material

Jong-Min KIM; Kiyokazu YASUDA; Young-Eui SHIN; Kozo FUJIMOTO

3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material

Jong-Min KIM, Kiyokazu YASUDA, Young-Eui SHIN, Kozo FUJIMOTO

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A novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices in 3-D space has been proposed. The vertical alignment can be controlled by using of metal sphere, reducing the necessary precise process control such as solder volumes and external forces, and allowing large tolerances in liquid volume and misalignment. Lateral alignment could be also achieved by making the liquid resin constrained on the 3-dimensional pads on chip and substrate. This study focused on the principle of self-alignment and final alignment accuracy. In addition, the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. An average alignment accuracy of less than 0.25 µm has been obtained. It is thought that this process is effective for assembly simply at low process temperature, low cost and without flux in future assembly techniques.

Publication: IEICE TRANSACTIONS on Electronics Vol.E85-C No.7 pp.1491-1498

Publication Date: 2002/07/01

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Type of Manuscript: PAPER

Category: Integrated Electronics

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Jong-Min KIM, Kiyokazu YASUDA, Young-Eui SHIN, Kozo FUJIMOTO, "3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material" in IEICE TRANSACTIONS on Electronics, vol. E85-C, no. 7, pp. 1491-1498, July 2002, doi: .
Abstract: A novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices in 3-D space has been proposed. The vertical alignment can be controlled by using of metal sphere, reducing the necessary precise process control such as solder volumes and external forces, and allowing large tolerances in liquid volume and misalignment. Lateral alignment could be also achieved by making the liquid resin constrained on the 3-dimensional pads on chip and substrate. This study focused on the principle of self-alignment and final alignment accuracy. In addition, the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. An average alignment accuracy of less than 0.25 µm has been obtained. It is thought that this process is effective for assembly simply at low process temperature, low cost and without flux in future assembly techniques.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e85-c_7_1491/_p

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@ARTICLE{e85-c_7_1491,
author={Jong-Min KIM, Kiyokazu YASUDA, Young-Eui SHIN, Kozo FUJIMOTO, },
journal={IEICE TRANSACTIONS on Electronics},
title={3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material},
year={2002},
volume={E85-C},
number={7},
pages={1491-1498},
abstract={A novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices in 3-D space has been proposed. The vertical alignment can be controlled by using of metal sphere, reducing the necessary precise process control such as solder volumes and external forces, and allowing large tolerances in liquid volume and misalignment. Lateral alignment could be also achieved by making the liquid resin constrained on the 3-dimensional pads on chip and substrate. This study focused on the principle of self-alignment and final alignment accuracy. In addition, the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. An average alignment accuracy of less than 0.25 µm has been obtained. It is thought that this process is effective for assembly simply at low process temperature, low cost and without flux in future assembly techniques.},
keywords={},
doi={},
ISSN={},
month={July},}

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TY - JOUR
TI - 3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material
T2 - IEICE TRANSACTIONS on Electronics
SP - 1491
EP - 1498
AU - Jong-Min KIM
AU - Kiyokazu YASUDA
AU - Young-Eui SHIN
AU - Kozo FUJIMOTO
PY - 2002
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E85-C
IS - 7
JA - IEICE TRANSACTIONS on Electronics
Y1 - July 2002
AB - A novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices in 3-D space has been proposed. The vertical alignment can be controlled by using of metal sphere, reducing the necessary precise process control such as solder volumes and external forces, and allowing large tolerances in liquid volume and misalignment. Lateral alignment could be also achieved by making the liquid resin constrained on the 3-dimensional pads on chip and substrate. This study focused on the principle of self-alignment and final alignment accuracy. In addition, the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. An average alignment accuracy of less than 0.25 µm has been obtained. It is thought that this process is effective for assembly simply at low process temperature, low cost and without flux in future assembly techniques.
ER -