Field Configurable Self-assembly is a novel programmable force field based heterogeneous integration technology. Herein, we demonstrate application of the method to rapid, parallel assembly of similar and dissimilar sub-200 µm GaAs-based light emitting diodes at silicon chip substrates. We also show that the method is compatible with post-process collective wiring techniques for fully planar hybrid integration of active devices.
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
Copy
Alan O'RIORDAN, Gareth REDMOND, Thierry DEAN, Mathias PEZ, "Field Configurable Self-Assembly: A New Heterogeneous Integration Technology" in IEICE TRANSACTIONS on Electronics,
vol. E86-C, no. 10, pp. 1977-1984, October 2003, doi: .
Abstract: Field Configurable Self-assembly is a novel programmable force field based heterogeneous integration technology. Herein, we demonstrate application of the method to rapid, parallel assembly of similar and dissimilar sub-200 µm GaAs-based light emitting diodes at silicon chip substrates. We also show that the method is compatible with post-process collective wiring techniques for fully planar hybrid integration of active devices.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e86-c_10_1977/_p
Copy
@ARTICLE{e86-c_10_1977,
author={Alan O'RIORDAN, Gareth REDMOND, Thierry DEAN, Mathias PEZ, },
journal={IEICE TRANSACTIONS on Electronics},
title={Field Configurable Self-Assembly: A New Heterogeneous Integration Technology},
year={2003},
volume={E86-C},
number={10},
pages={1977-1984},
abstract={Field Configurable Self-assembly is a novel programmable force field based heterogeneous integration technology. Herein, we demonstrate application of the method to rapid, parallel assembly of similar and dissimilar sub-200 µm GaAs-based light emitting diodes at silicon chip substrates. We also show that the method is compatible with post-process collective wiring techniques for fully planar hybrid integration of active devices.},
keywords={},
doi={},
ISSN={},
month={October},}
Copy
TY - JOUR
TI - Field Configurable Self-Assembly: A New Heterogeneous Integration Technology
T2 - IEICE TRANSACTIONS on Electronics
SP - 1977
EP - 1984
AU - Alan O'RIORDAN
AU - Gareth REDMOND
AU - Thierry DEAN
AU - Mathias PEZ
PY - 2003
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E86-C
IS - 10
JA - IEICE TRANSACTIONS on Electronics
Y1 - October 2003
AB - Field Configurable Self-assembly is a novel programmable force field based heterogeneous integration technology. Herein, we demonstrate application of the method to rapid, parallel assembly of similar and dissimilar sub-200 µm GaAs-based light emitting diodes at silicon chip substrates. We also show that the method is compatible with post-process collective wiring techniques for fully planar hybrid integration of active devices.
ER -