Application of Gold Powder Made from Gold Leaf for Conductive Inks
Summary :
In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2kΩ to 1 Ω by adding only 2.0wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E102-C No.2 pp.176-179
- Publication Date
- 2019/02/01
- Publicized
- Online ISSN
- 1745-1353
- DOI
- 10.1587/transele.2018OMS0009
- Type of Manuscript
- BRIEF PAPER
- Category
Authors
Sayaka YAMASHITA
Japan Advanced Institute of Science and Technology
Heisuke SAKAI
Japan Advanced Institute of Science and Technology
Hideyuki MURATA
Japan Advanced Institute of Science and Technology
Keyword
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Sayaka YAMASHITA, Heisuke SAKAI, Hideyuki MURATA, "Application of Gold Powder Made from Gold Leaf for Conductive Inks" in IEICE TRANSACTIONS on Electronics,
vol. E102-C, no. 2, pp. 176-179, February 2019, doi: 10.1587/transele.2018OMS0009.
Abstract: In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2kΩ to 1 Ω by adding only 2.0wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2018OMS0009/_p
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@ARTICLE{e102-c_2_176,
author={Sayaka YAMASHITA, Heisuke SAKAI, Hideyuki MURATA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Application of Gold Powder Made from Gold Leaf for Conductive Inks},
year={2019},
volume={E102-C},
number={2},
pages={176-179},
abstract={In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2kΩ to 1 Ω by adding only 2.0wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.},
keywords={},
doi={10.1587/transele.2018OMS0009},
ISSN={1745-1353},
month={February},}
Copy
TY - JOUR
TI - Application of Gold Powder Made from Gold Leaf for Conductive Inks
T2 - IEICE TRANSACTIONS on Electronics
SP - 176
EP - 179
AU - Sayaka YAMASHITA
AU - Heisuke SAKAI
AU - Hideyuki MURATA
PY - 2019
DO - 10.1587/transele.2018OMS0009
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E102-C
IS - 2
JA - IEICE TRANSACTIONS on Electronics
Y1 - February 2019
AB - In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2kΩ to 1 Ω by adding only 2.0wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.
ER -
English
