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Room-Temperature Atomic Layer Deposition of SnO2 Using Tetramethyltin and Its Application to TFT Fabrication

Kentaro TOKORO, Shunsuke SAITO, Kensaku KANOMATA, Masanori MIURA, Bashir AHMMAD, Shigeru KUBOTA, Fumihiko HIROSE

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Summary :

We report room-temperature atomic layer deposition (ALD) of SnO2 using tetramethyltin (TMT) as a precursor and plasma-excited humidified argon as an oxidizing gas and investigate the saturation behaviors of these gases on SnO2-covered Si prisms by IR absorption spectroscopy to determine optimal precursor/oxidizer injection conditions. TMT is demonstrated to adsorb on the SnO2 surface by reacting with surface OH groups, which are regenerated by oxidizing the TMT-saturated surface by plasma-excited humidified argon. We provide a detailed discussion of the growth mechanism. We also report the RT ALD application to the RT TFT fabrication.

Publication
IEICE TRANSACTIONS on Electronics Vol.E101-C No.5 pp.317-322
Publication Date
2018/05/01
Publicized
Online ISSN
1745-1353
DOI
10.1587/transele.E101.C.317
Type of Manuscript
Special Section PAPER (Special Section on Fundamentals and Applications of Advanced Semiconductor Devices)
Category

Authors

Kentaro TOKORO
  Yamagata University
Shunsuke SAITO
  Yamagata University
Kensaku KANOMATA
  Yamagata University
Masanori MIURA
  Yamagata University
Bashir AHMMAD
  Yamagata University
Shigeru KUBOTA
  Yamagata University
Fumihiko HIROSE
  Yamagata University

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