IEICE TRANSACTIONS on Fundamentals
On-Chip Thermal Gradient Analysis Considering Interdependence between Leakage Power and Temperature
Summary :
In this paper, we propose a methodology for calculating on-chip temperature gradient and leakage power distributions. It considers the interdependence between leakage power and local temperature using a general circuit simulator as a differential equation solver. The proposed methodology can be utilized in the early stages of the design cycle as well as in the final verification phase. Simulation results proved that consideration of the temperature dependence of the leakage power is critically important for achieving reliable physical designs since the conventional temperature analysis that ignores the interdependence underestimates leakage power considerably and may overlook potential thermal runaway.
- Publication
- IEICE TRANSACTIONS on Fundamentals Vol.E89-A No.12 pp.3491-3499
- Publication Date
- 2006/12/01
- Publicized
- Online ISSN
- 1745-1337
- DOI
- 10.1093/ietfec/e89-a.12.3491
- Type of Manuscript
- Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
- Category
- Simulation and Verification
Authors
Keyword
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Takashi SATO, Junji ICHIMIYA, Nobuto ONO, Masanori HASHIMOTO, "On-Chip Thermal Gradient Analysis Considering Interdependence between Leakage Power and Temperature" in IEICE TRANSACTIONS on Fundamentals,
vol. E89-A, no. 12, pp. 3491-3499, December 2006, doi: 10.1093/ietfec/e89-a.12.3491.
Abstract: In this paper, we propose a methodology for calculating on-chip temperature gradient and leakage power distributions. It considers the interdependence between leakage power and local temperature using a general circuit simulator as a differential equation solver. The proposed methodology can be utilized in the early stages of the design cycle as well as in the final verification phase. Simulation results proved that consideration of the temperature dependence of the leakage power is critically important for achieving reliable physical designs since the conventional temperature analysis that ignores the interdependence underestimates leakage power considerably and may overlook potential thermal runaway.
URL: https://global.ieice.org/en_transactions/fundamentals/10.1093/ietfec/e89-a.12.3491/_p
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@ARTICLE{e89-a_12_3491,
author={Takashi SATO, Junji ICHIMIYA, Nobuto ONO, Masanori HASHIMOTO, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={On-Chip Thermal Gradient Analysis Considering Interdependence between Leakage Power and Temperature},
year={2006},
volume={E89-A},
number={12},
pages={3491-3499},
abstract={In this paper, we propose a methodology for calculating on-chip temperature gradient and leakage power distributions. It considers the interdependence between leakage power and local temperature using a general circuit simulator as a differential equation solver. The proposed methodology can be utilized in the early stages of the design cycle as well as in the final verification phase. Simulation results proved that consideration of the temperature dependence of the leakage power is critically important for achieving reliable physical designs since the conventional temperature analysis that ignores the interdependence underestimates leakage power considerably and may overlook potential thermal runaway.},
keywords={},
doi={10.1093/ietfec/e89-a.12.3491},
ISSN={1745-1337},
month={December},}
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TY - JOUR
TI - On-Chip Thermal Gradient Analysis Considering Interdependence between Leakage Power and Temperature
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 3491
EP - 3499
AU - Takashi SATO
AU - Junji ICHIMIYA
AU - Nobuto ONO
AU - Masanori HASHIMOTO
PY - 2006
DO - 10.1093/ietfec/e89-a.12.3491
JO - IEICE TRANSACTIONS on Fundamentals
SN - 1745-1337
VL - E89-A
IS - 12
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - December 2006
AB - In this paper, we propose a methodology for calculating on-chip temperature gradient and leakage power distributions. It considers the interdependence between leakage power and local temperature using a general circuit simulator as a differential equation solver. The proposed methodology can be utilized in the early stages of the design cycle as well as in the final verification phase. Simulation results proved that consideration of the temperature dependence of the leakage power is critically important for achieving reliable physical designs since the conventional temperature analysis that ignores the interdependence underestimates leakage power considerably and may overlook potential thermal runaway.
ER -
English
