A Novel Expression of Spatial Correlation by a Random Curved Surface Model and Its Application to LSI Design
Summary :
We have proposed a random curved surface model as a new mathematical concept which enables the expression of spatial correlation. The model gives us an appropriate methodology to deal with the systematic components of device variation in an LSI chip. The key idea of the model is the fitting of a polynomial to an array of Gaussian random numbers. The curved surface is expressed by a new extension from the Legendre polynomials to form two-dimensional formulas. The formulas were proven to be suitable to express the spatial correlation with reasonable computational complexity. In this paper, we show that this approach is useful in analyzing characteristics of device variation of actual chips by using experimental data.
- Publication
- IEICE TRANSACTIONS on Fundamentals Vol.E91-A No.4 pp.1062-1070
- Publication Date
- 2008/04/01
- Publicized
- Online ISSN
- 1745-1337
- DOI
- 10.1093/ietfec/e91-a.4.1062
- Type of Manuscript
- Special Section PAPER (Special Section on Selected Papers from the 20th Workshop on Circuits and Systems in Karuizawa)
- Category
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Shin-ichi OHKAWA, Hiroo MASUDA, Yasuaki INOUE, "A Novel Expression of Spatial Correlation by a Random Curved Surface Model and Its Application to LSI Design" in IEICE TRANSACTIONS on Fundamentals,
vol. E91-A, no. 4, pp. 1062-1070, April 2008, doi: 10.1093/ietfec/e91-a.4.1062.
Abstract: We have proposed a random curved surface model as a new mathematical concept which enables the expression of spatial correlation. The model gives us an appropriate methodology to deal with the systematic components of device variation in an LSI chip. The key idea of the model is the fitting of a polynomial to an array of Gaussian random numbers. The curved surface is expressed by a new extension from the Legendre polynomials to form two-dimensional formulas. The formulas were proven to be suitable to express the spatial correlation with reasonable computational complexity. In this paper, we show that this approach is useful in analyzing characteristics of device variation of actual chips by using experimental data.
URL: https://global.ieice.org/en_transactions/fundamentals/10.1093/ietfec/e91-a.4.1062/_p
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@ARTICLE{e91-a_4_1062,
author={Shin-ichi OHKAWA, Hiroo MASUDA, Yasuaki INOUE, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={A Novel Expression of Spatial Correlation by a Random Curved Surface Model and Its Application to LSI Design},
year={2008},
volume={E91-A},
number={4},
pages={1062-1070},
abstract={We have proposed a random curved surface model as a new mathematical concept which enables the expression of spatial correlation. The model gives us an appropriate methodology to deal with the systematic components of device variation in an LSI chip. The key idea of the model is the fitting of a polynomial to an array of Gaussian random numbers. The curved surface is expressed by a new extension from the Legendre polynomials to form two-dimensional formulas. The formulas were proven to be suitable to express the spatial correlation with reasonable computational complexity. In this paper, we show that this approach is useful in analyzing characteristics of device variation of actual chips by using experimental data.},
keywords={},
doi={10.1093/ietfec/e91-a.4.1062},
ISSN={1745-1337},
month={April},}
Copy
TY - JOUR
TI - A Novel Expression of Spatial Correlation by a Random Curved Surface Model and Its Application to LSI Design
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 1062
EP - 1070
AU - Shin-ichi OHKAWA
AU - Hiroo MASUDA
AU - Yasuaki INOUE
PY - 2008
DO - 10.1093/ietfec/e91-a.4.1062
JO - IEICE TRANSACTIONS on Fundamentals
SN - 1745-1337
VL - E91-A
IS - 4
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - April 2008
AB - We have proposed a random curved surface model as a new mathematical concept which enables the expression of spatial correlation. The model gives us an appropriate methodology to deal with the systematic components of device variation in an LSI chip. The key idea of the model is the fitting of a polynomial to an array of Gaussian random numbers. The curved surface is expressed by a new extension from the Legendre polynomials to form two-dimensional formulas. The formulas were proven to be suitable to express the spatial correlation with reasonable computational complexity. In this paper, we show that this approach is useful in analyzing characteristics of device variation of actual chips by using experimental data.
ER -
English
