We proposed a new marker design for passive alignment of a laser to a fiber on a silicon waferboard. Our fiducial marker is simple form and easy to fabricate. With a unique marker design, high accurate positioning of the laser chip is easily achieved using a conventional flip-chip bonder. We have successfully fabricated laser modules with uniform coupling, within 1 dB for a flat end single-mode fiber and within 2 dB for a hemispherical end fiber. This assembly method offers the potential for low-cost optical module packaging.

Laser module fabricated with silicon platform technology is very attractive for low-cost modules. The technology enables passive optical alignment of an LD to an optical fiber. Our marker design for passive alignment allows positioning accuracy within 1 µm of LD. However, coupling efficiency is a key issue because that by conventional butt coupling scheme is low with about 10 dB coupling loss. We investigated optical coupling characteristics in various types of coupling scheme: conventional flat end fibers, cone fibers, integrated GRIN rod lenses on the platform and the coupling with new-type LDs integrated with spot size transformer. Improvement of coupling efficiency with 3 dB and 7.5 dB compared to flat-end fiber is achieved by using the cone fiber and the GRIN rod lens, respectively, although 1-dB coupling tolerances for alignment deteriorated with these schemes. We obtained high efficient coupling with 3.5 dB coupling loss and wide alignment tolerance of 2.3 µm simultaneously with a new-type LD integrated with spot size transformer owing to its expanded spot size characteristics.