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[Author] Kazuhiro TANAKA(5hit)

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  • Isolator-Free DFB-LD Module with TEC Control Using Silicon Waferboard

    Koji TERADA  Seimi SASAKI  Kazuhiro TANAKA  Tsuyoshi YAMAMOTO  Tadashi IKEUCHI  Kazunori MIURA  Mitsuhiro YANO  

     
    LETTER-Optoelectronic Packaging

      Vol:
    E80-C No:5
      Page(s):
    703-706

    This letter describes our DFB-LD module for use in WDM optical access networks. We realized an isolator-free DFB-LD module with a thermo-electric cooler in aim of stabilizing the emission wavelength for WDM systems. Silicon waferboard technology was employed to achieve simple assembly and small size of the module. This small size contributed to low TEC power. Our fabricated module demonstrated low-noise and stable emission wavelength characteristics under 156 Mbit/s pseudo random modulation.

  • High Optical Coupling Scheme in LD Modules with Silicon Platform Technology

    Kazuhiro TANAKA  Seimi SASAKI  Gohji NAKAGAWA  Tsuyoshi YAMAMOTO  Kazunori MIURA  Shouichi OGITA  Mitsuhiro YANO  

     
    PAPER

      Vol:
    E80-C No:1
      Page(s):
    107-111

    Laser module fabricated with silicon platform technology is very attractive for low-cost modules. The technology enables passive optical alignment of an LD to an optical fiber. Our marker design for passive alignment allows positioning accuracy within 1 µm of LD. However, coupling efficiency is a key issue because that by conventional butt coupling scheme is low with about 10 dB coupling loss. We investigated optical coupling characteristics in various types of coupling scheme: conventional flat end fibers, cone fibers, integrated GRIN rod lenses on the platform and the coupling with new-type LDs integrated with spot size transformer. Improvement of coupling efficiency with 3 dB and 7.5 dB compared to flat-end fiber is achieved by using the cone fiber and the GRIN rod lens, respectively, although 1-dB coupling tolerances for alignment deteriorated with these schemes. We obtained high efficient coupling with 3.5 dB coupling loss and wide alignment tolerance of 2.3 µm simultaneously with a new-type LD integrated with spot size transformer owing to its expanded spot size characteristics.

  • Fiber-Optic Low Coherence Velocimetry by Detecting Interference Fluctuations

    Yoh IMAI  Kazuhiro TANAKA  

     
    PAPER-Distributed Sensing

      Vol:
    E83-C No:3
      Page(s):
    423-427

    A new sensing method for measuring directly flow velocity by using low coherence interference techniques is proposed and demonstrated. In this method, a temporally fluctuating signal, not the Doppler frequency shift, is detected. Theoretical analysis shows that a spectrum of light backscattered from a particle takes a Gaussian form whose width is simply proportional to the flow velocity. The measured velocity is in good agreement with the actual flow velocity derived from the flow rate. The dynamic range of this sensing method is governed by the frequency range of the FFT processor used and is estimated to be 1.4 10-4 14 m/s. The depth position can be adjusted with an accuracy of approximately 30 µm which is determined by the coherence length of the light source. The velocity distribution along the depth is easily measured by changing mechanically the length of the reference arm in the low coherence interferometer.

  • High-Speed Modulation with Low-Threshold 1.3µm-Wavelength MQW Laser Diodes

    Kazuhiro TANAKA  Kaoru NAKAJIMA  Tetsufumi ODAGAWA  Hiroyuki NOBUHARA  Kiyohide WAKAO  

     
    LETTER

      Vol:
    E78-C No:1
      Page(s):
    91-93

    Laser diodes for optical interconnections are ideally high speed, work over a wide temperature range, and are simple to bias. This paper reports high bit-rate modulation with nearly zero bias with very low threshold 1.3µm-wavelength laser diodes over a wide temperature range. At the high temperature of 80, lasing delay was 165 ps with nearly zero bias. We demonstrated 2.5 Gbit/s modulation over a wide temperature range. Eye opening was over 34% of one time slot.

  • Marker Alignment Method for Passive Laser Coupling on Silicon Waferboard

    Seimi SASAKI  Gohji NAKAGAWA  Kazuhiro TANAKA  Kazunori MIURA  Mituhiro YANO  

     
    LETTER

      Vol:
    E79-B No:7
      Page(s):
    939-942

    We proposed a new marker design for passive alignment of a laser to a fiber on a silicon waferboard. Our fiducial marker is simple form and easy to fabricate. With a unique marker design, high accurate positioning of the laser chip is easily achieved using a conventional flip-chip bonder. We have successfully fabricated laser modules with uniform coupling, within 1 dB for a flat end single-mode fiber and within 2 dB for a hemispherical end fiber. This assembly method offers the potential for low-cost optical module packaging.