In the transferred bump TAB (Tape Automated Bonding) technology, the bumps are transferred on the film leads, and these bumps and the aluminum electrode of an LSI chip are gang-bonded together. This technology make possible a compact semiconductor package of low cost and high reliability. In this technology, the bump formation technology and the substrate technology for the bump formation and the bonding technology contribute to its important element technology. In this treatise, the substrate technology for the bump formation and the bump formation technology corresponding to multielectrodes transferred bump TAB package will be addressed. In addition, an application for TAB package of 100 µm pitch, 444-pin will be presented.