In this paper, we propose a novel migration method. In this method, the resultant placement retains the structure of the original placement, called model placement, as much as possible. For this purpose, we minimize the sum of the difference in area between the model placement and the relocated one and the total amount of displacement between them. Moreover, to achieve a short runtime, we limit the solution space and change the packing origin in the optimization process. We construct the system on Sequence-Pair. Experimental results show that our approach preserves the chip area and the overall circuit structure with 98% less runtime than that realized by naive simulated annealing.