We have succeeded in developing three techniques, a precise lens-alignment technique, low-loss built-in Spatial Multiplexing optics and a well-matched electrical connection for high-frequency signals, which are indispensable for realizing compact high-performance TOSAs and ROSAs employing hybrid integration technology. The lens position was controlled to within ±0.3 µm by high-power laser irradiation. All components comprising the multiplexing optics are bonded to a prism, enabling the insertion loss to be held down to 0.8 dB due to the dimensional accuracy of the prism. The addition of an FPC layer reduced the impedance mismatch at the junction between the FPC and PCB. We demonstrated a compact integrated four-lane 25 Gb/s TOSA (15.1 mm × 6.5 mm × 5.6 mm) and ROSA (17.0 mm × 12.0 mm × 7.0 mm) using the built-in spatial Mux/Demux optics with good transmission performance for 100 Gb/s Ethernet. These are respectively suitable for the QSFP28 and CFP2 form factors.

Ethernet has become an indispensable technology for communications, and has come into use for many applications. At the IEEE, high-speed standardization has been discussed and has seen the adoption of new technologies such as multi-level modulation formats, high baud rate modulation and dense wave length division multiplexing. The MSA transceiver form factor has also been discussed following IEEE standardization. Optical devices such as TOSA and ROSA have been required to become more compact and higher-speed, because each transceiver form factor has to be miniaturized for high-density construction. We introduce the technologies for realizing 100GbE and those applicable to 400GbE. We also discuss future packages for optical devices. There are many similarities between optical device packages and electrical device packages, and we predict that optical device packages will follow the trends seen in electrical devices. But there are also differences between optical and electrical devices. It is necessary to utilize new technology for specific optical issues to employ advanced electrical packaging and catch up the trends.