Three-dimensional (3-D) instrumentation using an image sequence is a promising instrumentation method for intelligent systems in which accurate 3-D information is required. However, real-time instrumentation is difficult since much computation time and a large memory bandwidth are required. In this paper, a 3-D instrumentation VLSI processor with a concurrent memory-access scheme is proposed. To reduce the access time, frequently used data are stored in a cache register array and are concurrently transferred to processing elements using simple interconnections to the 8-nearest neighbor registers. Based on a row and column memory access pattern, we propose a diagonally interleaved frame memory by which pixel values of a row and column are stored across memory modules. Based on the concurrent memory-access scheme, a 40 GOPS vprocessor is designed and the delay time for the instrumentation is estimated to be 42 ms for a 256256 images.