A novel thick ground plane is proposed as a support for a slot-coupled microstrip antenna and as a heat sink for an MMIC installed on the back plane of the active array antenna. A multi-layer structure of ground planes is also studied for the benefit of easy installation of MMICs. The influence of this thick metal ground plane with a mono- and multi-layer has been investigated in detail. Both measured and calculated results of VSWR and calculated results of the back lobe are shown in detail. The calculated results of VSWR agree well with the measurements. It is made clear that the thickness of the ground plane can be extended to twenty times that of the antenna substrate while maintaining the antenna's performance. An LNA composing an MMIC was developed, attached to the back of the antenna, and operated at 23 GHz. The measured results of this active element agree well with calculated ones and confirm the applicability of the novel design.