A Slot Coupled Microstrip Antenna with a Multi-Layer Thick Ground Plane
Summary :
A novel thick ground plane is proposed as a support for a slot-coupled microstrip antenna and as a heat sink for an MMIC installed on the back plane of the active array antenna. A multi-layer structure of ground planes is also studied for the benefit of easy installation of MMICs. The influence of this thick metal ground plane with a mono- and multi-layer has been investigated in detail. Both measured and calculated results of VSWR and calculated results of the back lobe are shown in detail. The calculated results of VSWR agree well with the measurements. It is made clear that the thickness of the ground plane can be extended to twenty times that of the antenna substrate while maintaining the antenna's performance. An LNA composing an MMIC was developed, attached to the back of the antenna, and operated at 23 GHz. The measured results of this active element agree well with calculated ones and confirm the applicability of the novel design.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E78-C No.8 pp.988-994
- Publication Date
- 1995/08/25
- Publicized
- Online ISSN
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- Type of Manuscript
- Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology)
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Kazunori TAKEUCHI, Isamu CHIBA, Yoshio KARASAWA, "A Slot Coupled Microstrip Antenna with a Multi-Layer Thick Ground Plane" in IEICE TRANSACTIONS on Electronics,
vol. E78-C, no. 8, pp. 988-994, August 1995, doi: .
Abstract: A novel thick ground plane is proposed as a support for a slot-coupled microstrip antenna and as a heat sink for an MMIC installed on the back plane of the active array antenna. A multi-layer structure of ground planes is also studied for the benefit of easy installation of MMICs. The influence of this thick metal ground plane with a mono- and multi-layer has been investigated in detail. Both measured and calculated results of VSWR and calculated results of the back lobe are shown in detail. The calculated results of VSWR agree well with the measurements. It is made clear that the thickness of the ground plane can be extended to twenty times that of the antenna substrate while maintaining the antenna's performance. An LNA composing an MMIC was developed, attached to the back of the antenna, and operated at 23 GHz. The measured results of this active element agree well with calculated ones and confirm the applicability of the novel design.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e78-c_8_988/_p
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@ARTICLE{e78-c_8_988,
author={Kazunori TAKEUCHI, Isamu CHIBA, Yoshio KARASAWA, },
journal={IEICE TRANSACTIONS on Electronics},
title={A Slot Coupled Microstrip Antenna with a Multi-Layer Thick Ground Plane},
year={1995},
volume={E78-C},
number={8},
pages={988-994},
abstract={A novel thick ground plane is proposed as a support for a slot-coupled microstrip antenna and as a heat sink for an MMIC installed on the back plane of the active array antenna. A multi-layer structure of ground planes is also studied for the benefit of easy installation of MMICs. The influence of this thick metal ground plane with a mono- and multi-layer has been investigated in detail. Both measured and calculated results of VSWR and calculated results of the back lobe are shown in detail. The calculated results of VSWR agree well with the measurements. It is made clear that the thickness of the ground plane can be extended to twenty times that of the antenna substrate while maintaining the antenna's performance. An LNA composing an MMIC was developed, attached to the back of the antenna, and operated at 23 GHz. The measured results of this active element agree well with calculated ones and confirm the applicability of the novel design.},
keywords={},
doi={},
ISSN={},
month={August},}
Copy
TY - JOUR
TI - A Slot Coupled Microstrip Antenna with a Multi-Layer Thick Ground Plane
T2 - IEICE TRANSACTIONS on Electronics
SP - 988
EP - 994
AU - Kazunori TAKEUCHI
AU - Isamu CHIBA
AU - Yoshio KARASAWA
PY - 1995
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E78-C
IS - 8
JA - IEICE TRANSACTIONS on Electronics
Y1 - August 1995
AB - A novel thick ground plane is proposed as a support for a slot-coupled microstrip antenna and as a heat sink for an MMIC installed on the back plane of the active array antenna. A multi-layer structure of ground planes is also studied for the benefit of easy installation of MMICs. The influence of this thick metal ground plane with a mono- and multi-layer has been investigated in detail. Both measured and calculated results of VSWR and calculated results of the back lobe are shown in detail. The calculated results of VSWR agree well with the measurements. It is made clear that the thickness of the ground plane can be extended to twenty times that of the antenna substrate while maintaining the antenna's performance. An LNA composing an MMIC was developed, attached to the back of the antenna, and operated at 23 GHz. The measured results of this active element agree well with calculated ones and confirm the applicability of the novel design.
ER -
English
