As the VLSI manufacturing technology shrinks to 65 nm and below, reducing the yield loss induced by via failures is a critical issue in design for manufacturability (DFM). Semiconductor foundries highly recommend using the double-via insertion (DVI) method to improve yield and reliability of designs. This work applies the DVI method in the post-stage of an X-architecture clock routing for double-via insertion rate improvement. The proposed DVI-X algorithm constructs the bipartite graphs of the partitioned clock routing layout with single vias and redundant-via candidates (RVCs). Then, DVI-X applies the augmenting path approach associated with the construction of the maximal cliques to obtain the matching solution from the bipartite graphs. Experimental results on benchmarks show that DVI-X can achieve higher double-via insertion rate by 3% and less running time by 68% than existing works. Moreover, a skew tuning technique is further applied to achieve zero skew because the inserted double vias affect the clock skew.

The occurrence of via defects increases due to the shrinking size in integrated circuit manufacturing. Redundant via insertion is an effective and recommended method to reduce the yield loss caused by via failures. In this paper, we introduce the redundant via allocation problem for layer partition-based redundant via insertion methods [1] and solve it using the genetic algorithm. At the same time, we use a convex-cost flow model to equilibrate the via density, which is good for the via density rules. The results of layer partition-based model depend on the partition and processing order of metal layers. Furthermore, even we try all of partitions and processing orders, we might miss the optimal solutions. By introducing the redundant via allocation problem on partitioning boundaries, we can avoid the sub-optimality of the original layer-partition based method. The experimental results show that the proposed method got 12 more redundant vias inserted on average and the via density balance can be greatly improved.