Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density

Song CHEN; Jianwei SHEN; Wei GUO; Mei-Fang CHIANG; Takeshi YOSHIMURA

doi:10.1587/transfun.E93.A.2372

Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density

Song CHEN, Jianwei SHEN, Wei GUO, Mei-Fang CHIANG, Takeshi YOSHIMURA

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The occurrence of via defects increases due to the shrinking size in integrated circuit manufacturing. Redundant via insertion is an effective and recommended method to reduce the yield loss caused by via failures. In this paper, we introduce the redundant via allocation problem for layer partition-based redundant via insertion methods [1] and solve it using the genetic algorithm. At the same time, we use a convex-cost flow model to equilibrate the via density, which is good for the via density rules. The results of layer partition-based model depend on the partition and processing order of metal layers. Furthermore, even we try all of partitions and processing orders, we might miss the optimal solutions. By introducing the redundant via allocation problem on partitioning boundaries, we can avoid the sub-optimality of the original layer-partition based method. The experimental results show that the proposed method got 12 more redundant vias inserted on average and the via density balance can be greatly improved.

Publication: IEICE TRANSACTIONS on Fundamentals Vol.E93-A No.12 pp.2372-2379

Publication Date: 2010/12/01

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Online ISSN: 1745-1337

DOI: 10.1587/transfun.E93.A.2372

Type of Manuscript: Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)

Category: Physical Level Design

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Song CHEN, Jianwei SHEN, Wei GUO, Mei-Fang CHIANG, Takeshi YOSHIMURA, "Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density" in IEICE TRANSACTIONS on Fundamentals, vol. E93-A, no. 12, pp. 2372-2379, December 2010, doi: 10.1587/transfun.E93.A.2372.
Abstract: The occurrence of via defects increases due to the shrinking size in integrated circuit manufacturing. Redundant via insertion is an effective and recommended method to reduce the yield loss caused by via failures. In this paper, we introduce the redundant via allocation problem for layer partition-based redundant via insertion methods [1] and solve it using the genetic algorithm. At the same time, we use a convex-cost flow model to equilibrate the via density, which is good for the via density rules. The results of layer partition-based model depend on the partition and processing order of metal layers. Furthermore, even we try all of partitions and processing orders, we might miss the optimal solutions. By introducing the redundant via allocation problem on partitioning boundaries, we can avoid the sub-optimality of the original layer-partition based method. The experimental results show that the proposed method got 12 more redundant vias inserted on average and the via density balance can be greatly improved.
URL: https://global.ieice.org/en_transactions/fundamentals/10.1587/transfun.E93.A.2372/_p

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@ARTICLE{e93-a_12_2372,
author={Song CHEN, Jianwei SHEN, Wei GUO, Mei-Fang CHIANG, Takeshi YOSHIMURA, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density},
year={2010},
volume={E93-A},
number={12},
pages={2372-2379},
abstract={The occurrence of via defects increases due to the shrinking size in integrated circuit manufacturing. Redundant via insertion is an effective and recommended method to reduce the yield loss caused by via failures. In this paper, we introduce the redundant via allocation problem for layer partition-based redundant via insertion methods [1] and solve it using the genetic algorithm. At the same time, we use a convex-cost flow model to equilibrate the via density, which is good for the via density rules. The results of layer partition-based model depend on the partition and processing order of metal layers. Furthermore, even we try all of partitions and processing orders, we might miss the optimal solutions. By introducing the redundant via allocation problem on partitioning boundaries, we can avoid the sub-optimality of the original layer-partition based method. The experimental results show that the proposed method got 12 more redundant vias inserted on average and the via density balance can be greatly improved.},
keywords={},
doi={10.1587/transfun.E93.A.2372},
ISSN={1745-1337},
month={December},}

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TY - JOUR
TI - Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 2372
EP - 2379
AU - Song CHEN
AU - Jianwei SHEN
AU - Wei GUO
AU - Mei-Fang CHIANG
AU - Takeshi YOSHIMURA
PY - 2010
DO - 10.1587/transfun.E93.A.2372
JO - IEICE TRANSACTIONS on Fundamentals
SN - 1745-1337
VL - E93-A
IS - 12
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - December 2010
AB - The occurrence of via defects increases due to the shrinking size in integrated circuit manufacturing. Redundant via insertion is an effective and recommended method to reduce the yield loss caused by via failures. In this paper, we introduce the redundant via allocation problem for layer partition-based redundant via insertion methods [1] and solve it using the genetic algorithm. At the same time, we use a convex-cost flow model to equilibrate the via density, which is good for the via density rules. The results of layer partition-based model depend on the partition and processing order of metal layers. Furthermore, even we try all of partitions and processing orders, we might miss the optimal solutions. By introducing the redundant via allocation problem on partitioning boundaries, we can avoid the sub-optimality of the original layer-partition based method. The experimental results show that the proposed method got 12 more redundant vias inserted on average and the via density balance can be greatly improved.
ER -