The role of hydrogen in the Si film during excimer laser annealing (ELA) has been successfully studied by using a novel sample structure, which is stacked by a-Si film and SiN film. Hydrogen contents in the Si films during ELA are changed by preparing samples with hydrogen content of 2.3-8.2 at.% in the SiN films with a use of catalytic (Cat)-CVD method. For the low concentration of hydrogens in the Si film, the grain size increases by decreasing hydrogen concentration in the Si film, and the internal stress of the film decreases as increasing the shot number. For the high concentration of hydrogens in the Si film, hydrogen burst was observed at 500 mJ/cm2 and the dependence of the internal stress on the shot number becomes weak even at 318 mJ/cm2. These phenomena can be understood basically using the secondary grain growth mechanism, which we have proposed.

Using various rare earth sesquioxides as additives, silicon nitride (Si3N4) samples were sintered at 1700 for 4 h by millimeter-wave heating performed in an applicator fed by a 28 GHz Gyrotron source under a nitrogen pressure of 0.1 MPa. A comparative study of densification, grain growth behavior and mechanical properties of silicon nitride fabricated by millimeter-wave and conventional sintering was carried out. Bulk densities were measured by Archimedes' technique. Except for the Eu2O3 containing sample, all samples were densified to relative densities of above 97.0%. Microstructure of the specimens was analyzed by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). To investigate quantitatively the effect of millimeter-wave heating on grain growth, image analysis was carried out for grains in the specimens. Fracture toughness was determined by the indentation-fracture method (IF method) in accordance with Japan Industrial Standards (JIS). Fully dense millimeter-wave sintered silicon nitride presenting a bimodal microstructure exhibited higher values of fracture toughness than materials processed by conventional heating techniques. Results indicate that millimeter-wave sintering is more effective in enhancing the grain growth and in producing the bimodal microstructure than conventional heating. It was also confirmed that localized runaway in temperature, depending upon the sintering additives, can occur under millimeter-wave heating.

A two-dimensional laser beam profiler has been developed that can measure the intensity distribution on a sample surface of a single-shot of an excimer-laser light beam from not only the macroscopic viewpoint, but also the microscopic viewpoint, which is important to excimer-laser triggered lateral large-grain growth of Si. A resolution as fine as 0.4 µm was obtained with a field of view of as large as 30 µm 30 µm. The effects of homogenizers, phase-shifters, and their combination on beam profiles were quantitatively investigated by using this apparatus. The relationship between the microscopic beam profile and the surface morphology of laterally grown grains was also examined.