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[Keyword] insulated metal substrate(1hit)

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  • Reliability of Sn-Sb Solder for Mounting Si Chip and Passive Elements on Insulated Metal Substrate

    Yasutoshi KURIHARA  Tsuneo ENDOH  

     
    PAPER-Integrated Electronics

      Vol:
    E81-C No:3
      Page(s):
    439-446

    Solder joint reliability was studied for hybrid ICs, in which chip components such as FETs, resistors and capacitors were mounted with Sn-Sb solder on an insulated Al substrate and transfer-molded with epoxy resin. Suitable resin selection for molding was also studied. The structure was estimated to have a lifetime of more than ten thousand cycles in the thermal cycling test under the condition of -55/150, for FETs and passive elements. Equivalent plastic strains generated in the soldering layer for the non-molded structure were 4. 6% for the FETs and 3.5% for the passive elements. But, these strains were approximately 1/3 to 1/2 and 1/10 for the molded structure, respectively. This was the main reason for high reliability of the molded structure. Resins with a wide range of thermal expansion coefficient(8-26 ppm/)could be put to practical use, because of the higher reliability of the molded structure. However, a thermal expansion coefficient of about 15 ppm/ was prefered to decrease stress at the interface between the substrate and the molding resin.