Reliability of Sn-Sb Solder for Mounting Si Chip and Passive Elements on Insulated Metal Substrate

Yasutoshi KURIHARA; Tsuneo ENDOH

Reliability of Sn-Sb Solder for Mounting Si Chip and Passive Elements on Insulated Metal Substrate

Yasutoshi KURIHARA, Tsuneo ENDOH

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Solder joint reliability was studied for hybrid ICs, in which chip components such as FETs, resistors and capacitors were mounted with Sn-Sb solder on an insulated Al substrate and transfer-molded with epoxy resin. Suitable resin selection for molding was also studied. The structure was estimated to have a lifetime of more than ten thousand cycles in the thermal cycling test under the condition of -55/150, for FETs and passive elements. Equivalent plastic strains generated in the soldering layer for the non-molded structure were 4. 6% for the FETs and 3.5% for the passive elements. But, these strains were approximately 1/3 to 1/2 and 1/10 for the molded structure, respectively. This was the main reason for high reliability of the molded structure. Resins with a wide range of thermal expansion coefficient(8-26 ppm/)could be put to practical use, because of the higher reliability of the molded structure. However, a thermal expansion coefficient of about 15 ppm/ was prefered to decrease stress at the interface between the substrate and the molding resin.

Publication: IEICE TRANSACTIONS on Electronics Vol.E81-C No.3 pp.439-446

Publication Date: 1998/03/25

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Category: Integrated Electronics

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Yasutoshi KURIHARA, Tsuneo ENDOH, "Reliability of Sn-Sb Solder for Mounting Si Chip and Passive Elements on Insulated Metal Substrate" in IEICE TRANSACTIONS on Electronics, vol. E81-C, no. 3, pp. 439-446, March 1998, doi: .
Abstract: Solder joint reliability was studied for hybrid ICs, in which chip components such as FETs, resistors and capacitors were mounted with Sn-Sb solder on an insulated Al substrate and transfer-molded with epoxy resin. Suitable resin selection for molding was also studied. The structure was estimated to have a lifetime of more than ten thousand cycles in the thermal cycling test under the condition of -55/150, for FETs and passive elements. Equivalent plastic strains generated in the soldering layer for the non-molded structure were 4. 6% for the FETs and 3.5% for the passive elements. But, these strains were approximately 1/3 to 1/2 and 1/10 for the molded structure, respectively. This was the main reason for high reliability of the molded structure. Resins with a wide range of thermal expansion coefficient(8-26 ppm/)could be put to practical use, because of the higher reliability of the molded structure. However, a thermal expansion coefficient of about 15 ppm/ was prefered to decrease stress at the interface between the substrate and the molding resin.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e81-c_3_439/_p

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@ARTICLE{e81-c_3_439,
author={Yasutoshi KURIHARA, Tsuneo ENDOH, },
journal={IEICE TRANSACTIONS on Electronics},
title={Reliability of Sn-Sb Solder for Mounting Si Chip and Passive Elements on Insulated Metal Substrate},
year={1998},
volume={E81-C},
number={3},
pages={439-446},
abstract={Solder joint reliability was studied for hybrid ICs, in which chip components such as FETs, resistors and capacitors were mounted with Sn-Sb solder on an insulated Al substrate and transfer-molded with epoxy resin. Suitable resin selection for molding was also studied. The structure was estimated to have a lifetime of more than ten thousand cycles in the thermal cycling test under the condition of -55/150, for FETs and passive elements. Equivalent plastic strains generated in the soldering layer for the non-molded structure were 4. 6% for the FETs and 3.5% for the passive elements. But, these strains were approximately 1/3 to 1/2 and 1/10 for the molded structure, respectively. This was the main reason for high reliability of the molded structure. Resins with a wide range of thermal expansion coefficient(8-26 ppm/)could be put to practical use, because of the higher reliability of the molded structure. However, a thermal expansion coefficient of about 15 ppm/ was prefered to decrease stress at the interface between the substrate and the molding resin.},
keywords={},
doi={},
ISSN={},
month={March},}

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TY - JOUR
TI - Reliability of Sn-Sb Solder for Mounting Si Chip and Passive Elements on Insulated Metal Substrate
T2 - IEICE TRANSACTIONS on Electronics
SP - 439
EP - 446
AU - Yasutoshi KURIHARA
AU - Tsuneo ENDOH
PY - 1998
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E81-C
IS - 3
JA - IEICE TRANSACTIONS on Electronics
Y1 - March 1998
AB - Solder joint reliability was studied for hybrid ICs, in which chip components such as FETs, resistors and capacitors were mounted with Sn-Sb solder on an insulated Al substrate and transfer-molded with epoxy resin. Suitable resin selection for molding was also studied. The structure was estimated to have a lifetime of more than ten thousand cycles in the thermal cycling test under the condition of -55/150, for FETs and passive elements. Equivalent plastic strains generated in the soldering layer for the non-molded structure were 4. 6% for the FETs and 3.5% for the passive elements. But, these strains were approximately 1/3 to 1/2 and 1/10 for the molded structure, respectively. This was the main reason for high reliability of the molded structure. Resins with a wide range of thermal expansion coefficient(8-26 ppm/)could be put to practical use, because of the higher reliability of the molded structure. However, a thermal expansion coefficient of about 15 ppm/ was prefered to decrease stress at the interface between the substrate and the molding resin.
ER -