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[Keyword] polyimide film(4hit)

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  • Formation of Polymer Walls by Monomer Aggregation Control Utilizing Substrate-Surface Wettability for Flexible LCDs Open Access

    Seiya KAWAMORITA  Yosei SHIBATA  Takahiro ISHINABE  Hideo FUJIKAKE  

     
    INVITED PAPER

      Vol:
    E100-C No:11
      Page(s):
    1005-1011

    We examined the novel aggregation control of the LC and monomer during formation of the polymer walls from a LC/monomer mixture in order to suppress the presence of the residual monomers and polymer networks in the pixel areas. The method is utilization of the differing wettabilities among LC and monomer molecules on a substrate surface. We patterned a substrate surface with a fluororesin and a polyimide film, and promoted phase separation of the LC and monomer by cooling process. This resulted in the LC and monomer aggregates primarily existing in the pixel areas and non-pixel areas, respectively. Moreover, the polymer-walls structure which was formed in this method partitioned into individual pixels in a lattice region and prevented the LC from flowing. This polymer-walls formation technique will be useful for developing high-quality flexible LCDs.

  • Characterization of Liquid Crystal Alignment on Rubbed Polyimide Film by Grazing-Incidence X-Ray Diffraction Open Access

    Tomoyuki KOGANEZAWA  Ichiro HIROSAWA  Hidenori ISHII  Takahiro SAKAI  

     
    INVITED PAPER

      Vol:
    E92-C No:11
      Page(s):
    1371-1375

    We developed a new method for characterizing molecular distribution in very thin liquid crystal layer (5-40 nm) evaporated onto rubbed polyimide film used by grazing-incidence X-ray diffraction (GIXD). The diffraction peaks corresponding to intermolecular correlation perpendicular to longitudinal axis of liquid crystal molecule and the clear anisotropic distribution of liquid crystal molecules in a thin layer were successfully observed. We found that in the vicinity of the alignment film, the intermolecular spacing correlation perpendicular to longitudinal axis of the 5CB molecule was expanded by the alignment film, and that the ordering of the 5CB was not so high. As the distance from the alignment film the spacing came close to the intrinsic intermolecular spacing.

  • Dependence of Kind of Solvents for Washing on Surface of Rubbed Polyimide Film

    Tomoyuki KOGANEZAWA  Ichiro HIROSAWA  Takahiro SAKAI  

     
    INVITED PAPER

      Vol:
    E91-C No:10
      Page(s):
    1587-1592

    We report effects of washing rubbed polyimide film on the near surface. Especially we focused dependence of solvent. Rubbed polyimide films have been used as liquid crystal alignment films in Liquid crystal displays (LCDs), and in actual LCD panel fabrication washing on film surfaces after rubbing is essential process to remove dust and pollution. We investigated the effects of washing by grazing incidence X-ray diffraction (GIXD) measurements. In GIXD, the X-ray penetration into the polymer was changed from 8 nm (suface sensitive) to 4 nm (bulk sensitive) by variation of the X-ray incidence angle. It was found that crystallization near the surface induced by soaking was considerably dependent on solvent. However, in-plane distribution of the surface polymer chains of polyimide film was not found to be dependent on the solvents.

  • A 48-Lead Film Carrier for Ultra-High Speed GaAs Digital Integrated Circuits

    Chiaki TAKUBO  Hiroshi TAZAWA  Mamoru SAKAKI  Yoshiharu TSUBOI  Masao MOCHIZUKI  Hirohiko IZUMI  

     
    PAPER

      Vol:
    E75-C No:10
      Page(s):
    1172-1178

    A film carrier with 48 peripheral-contacts, which is applicable to ultra-high speed GaAs digital integrated circuits (ICs) with a more than 10 Gbps operation, has been developed. The film carrier has been realized using the following newly developed techniques; (1) wave guides with a well-controlled characteristic impedance of 50 Ω, (2) precise vias of as small as 50 µm diameter conducting both sides of grounded metal planes on a polyimide film, and (3) a feed-through structure for high speed input signals with good impedance matching. The film carrier was molded by resin after ILB (inner lead bonding) to a chip with a copper plate heat spreader. As an application, the film carrier has been applied to a 3 Gbps operational 4-bit GaAs multiplexer IC, and has been proved to have excellent high-frequency characteristics.