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Makoto HASEGAWA Masato AKITA Kazutaka IZUMI Takayoshi KUBONO
We initiated development of our own data processing software for laser microscope data with C# language. This software is provided with volume calculation function of a target portion, based on a new calculation algorithm that can precisely handle the volume calculation of the portion located on a tilted surface or on a distorted surface. In this paper, this algorithm and some exemplary results obtained thereby, as well as some further development aims, are briefly described.
Akitaka MURATA Morio NAKAMURA Akira ASAI Ichiro TANIGUCHI
Surface damage to n-type silicon wafers induced by Reactive Ion Etching (RIE) with CF4 gas was evaluated using X-ray photoelectron spectroscopy (XPS) and the current-voltage (I-V) characteristics of Au/n-Si Schottky diodes fabricated on the damaged surface. The reaction products (SiF, SiF2, and SiF3) in the damaged layer were detected by XPS. Assuming the surface damage on a silicon wafer induced by RIE acts as a donor, the donor density was found to be about 21019 cm-3. The distribution of SiF3 and the donor density in the depth direction were almost equal. The thickness of the damaged layer was about 15 nm. These findings suggest that the donor in the damaged layer on a silicon surface induced by RIE may be SiF3.