Fundamental EMI source that generates common-mode radiation from printed circuit boards (PCBs) is investigated here. It is done by modelling the ground lines of PCBs as imperfect ground. The radiation emission in the far zones from PCBs is obtained by regarding interconnects on PCBs as transmission lines and the far field emission is evaluated based on the current distribution of the lines. The finite size ground trace is defined as an imperfect ground, that can be viewed as an inductive reactance which, in turn, causes the ground return path to radiate as a wire antenna. For the accurate analysis of imperfect ground effect, we divide the equivalent circuit into N sections. In addition, based on transverse electromagnetic (TEM) assumption, we estimate the electromagnetic interference (EMI) of three typical PCB geometries, namely, coplanar strips, parallel-plate strips and microstrips. The quantitative value of induced current distribution along the ground return path depends on the physical size, geometry and length of ground traces. Measured data are presented to confirm the result of numerical analysis. A knowledge of EMI source mechanisms and their relationship to layout geometries is necessary to determine the essential features that must be taken into account to estimate emissions and provide direction for reducing EMI due to interconnects on PCBs.
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I-Fong CHEN, Ching-Wen HSUE, "Evaluation of Common-Mode Radiation from Printed Circuit Boards by Modelling Imperfect Ground Effect" in IEICE TRANSACTIONS on Communications,
vol. E85-B, no. 12, pp. 2924-2933, December 2002, doi: .
Abstract: Fundamental EMI source that generates common-mode radiation from printed circuit boards (PCBs) is investigated here. It is done by modelling the ground lines of PCBs as imperfect ground. The radiation emission in the far zones from PCBs is obtained by regarding interconnects on PCBs as transmission lines and the far field emission is evaluated based on the current distribution of the lines. The finite size ground trace is defined as an imperfect ground, that can be viewed as an inductive reactance which, in turn, causes the ground return path to radiate as a wire antenna. For the accurate analysis of imperfect ground effect, we divide the equivalent circuit into N sections. In addition, based on transverse electromagnetic (TEM) assumption, we estimate the electromagnetic interference (EMI) of three typical PCB geometries, namely, coplanar strips, parallel-plate strips and microstrips. The quantitative value of induced current distribution along the ground return path depends on the physical size, geometry and length of ground traces. Measured data are presented to confirm the result of numerical analysis. A knowledge of EMI source mechanisms and their relationship to layout geometries is necessary to determine the essential features that must be taken into account to estimate emissions and provide direction for reducing EMI due to interconnects on PCBs.
URL: https://global.ieice.org/en_transactions/communications/10.1587/e85-b_12_2924/_p
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@ARTICLE{e85-b_12_2924,
author={I-Fong CHEN, Ching-Wen HSUE, },
journal={IEICE TRANSACTIONS on Communications},
title={Evaluation of Common-Mode Radiation from Printed Circuit Boards by Modelling Imperfect Ground Effect},
year={2002},
volume={E85-B},
number={12},
pages={2924-2933},
abstract={Fundamental EMI source that generates common-mode radiation from printed circuit boards (PCBs) is investigated here. It is done by modelling the ground lines of PCBs as imperfect ground. The radiation emission in the far zones from PCBs is obtained by regarding interconnects on PCBs as transmission lines and the far field emission is evaluated based on the current distribution of the lines. The finite size ground trace is defined as an imperfect ground, that can be viewed as an inductive reactance which, in turn, causes the ground return path to radiate as a wire antenna. For the accurate analysis of imperfect ground effect, we divide the equivalent circuit into N sections. In addition, based on transverse electromagnetic (TEM) assumption, we estimate the electromagnetic interference (EMI) of three typical PCB geometries, namely, coplanar strips, parallel-plate strips and microstrips. The quantitative value of induced current distribution along the ground return path depends on the physical size, geometry and length of ground traces. Measured data are presented to confirm the result of numerical analysis. A knowledge of EMI source mechanisms and their relationship to layout geometries is necessary to determine the essential features that must be taken into account to estimate emissions and provide direction for reducing EMI due to interconnects on PCBs.},
keywords={},
doi={},
ISSN={},
month={December},}
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TY - JOUR
TI - Evaluation of Common-Mode Radiation from Printed Circuit Boards by Modelling Imperfect Ground Effect
T2 - IEICE TRANSACTIONS on Communications
SP - 2924
EP - 2933
AU - I-Fong CHEN
AU - Ching-Wen HSUE
PY - 2002
DO -
JO - IEICE TRANSACTIONS on Communications
SN -
VL - E85-B
IS - 12
JA - IEICE TRANSACTIONS on Communications
Y1 - December 2002
AB - Fundamental EMI source that generates common-mode radiation from printed circuit boards (PCBs) is investigated here. It is done by modelling the ground lines of PCBs as imperfect ground. The radiation emission in the far zones from PCBs is obtained by regarding interconnects on PCBs as transmission lines and the far field emission is evaluated based on the current distribution of the lines. The finite size ground trace is defined as an imperfect ground, that can be viewed as an inductive reactance which, in turn, causes the ground return path to radiate as a wire antenna. For the accurate analysis of imperfect ground effect, we divide the equivalent circuit into N sections. In addition, based on transverse electromagnetic (TEM) assumption, we estimate the electromagnetic interference (EMI) of three typical PCB geometries, namely, coplanar strips, parallel-plate strips and microstrips. The quantitative value of induced current distribution along the ground return path depends on the physical size, geometry and length of ground traces. Measured data are presented to confirm the result of numerical analysis. A knowledge of EMI source mechanisms and their relationship to layout geometries is necessary to determine the essential features that must be taken into account to estimate emissions and provide direction for reducing EMI due to interconnects on PCBs.
ER -