IEICE TRANSACTIONS on Communications
Crosstalk Analysis for Embedded-Line Structure at PCB Using Circuit-Concept Approach
Summary :
An analytical method for estimating coupling between microstrip lines in arbitrary directions on adjacent layers in multi-layer printed circuit boards is studied: one line is embedded and the other is on the surface layer. Coupling or crosstalk has been estimated by development of a circuit-concept approach based on modified telegrapher's equations of the Agrawal approach instead of the Taylor approach for some computational advantages. Electromagnetic fields from the embedded microstrip line and the microstrip line on the surface can be obtained by using the electric image method for dielectric substrates. To verify the proposed approach, we conducted some experiments and compared the results of our approach with those of measurement and a commercial electromagnetic solver.
- Publication
- IEICE TRANSACTIONS on Communications Vol.E92-B No.6 pp.1945-1952
- Publication Date
- 2009/06/01
- Publicized
- Online ISSN
- 1745-1345
- DOI
- 10.1587/transcom.E92.B.1945
- Type of Manuscript
- Special Section PAPER (Special Section on 3rd Pan-Pacific EMC Joint Meeting -- PPEMC'08--)
- Category
Authors
Keyword
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Sang-Wook PARK, Fengchao XIAO, Yoshio KAMI, "Crosstalk Analysis for Embedded-Line Structure at PCB Using Circuit-Concept Approach" in IEICE TRANSACTIONS on Communications,
vol. E92-B, no. 6, pp. 1945-1952, June 2009, doi: 10.1587/transcom.E92.B.1945.
Abstract: An analytical method for estimating coupling between microstrip lines in arbitrary directions on adjacent layers in multi-layer printed circuit boards is studied: one line is embedded and the other is on the surface layer. Coupling or crosstalk has been estimated by development of a circuit-concept approach based on modified telegrapher's equations of the Agrawal approach instead of the Taylor approach for some computational advantages. Electromagnetic fields from the embedded microstrip line and the microstrip line on the surface can be obtained by using the electric image method for dielectric substrates. To verify the proposed approach, we conducted some experiments and compared the results of our approach with those of measurement and a commercial electromagnetic solver.
URL: https://global.ieice.org/en_transactions/communications/10.1587/transcom.E92.B.1945/_p
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@ARTICLE{e92-b_6_1945,
author={Sang-Wook PARK, Fengchao XIAO, Yoshio KAMI, },
journal={IEICE TRANSACTIONS on Communications},
title={Crosstalk Analysis for Embedded-Line Structure at PCB Using Circuit-Concept Approach},
year={2009},
volume={E92-B},
number={6},
pages={1945-1952},
abstract={An analytical method for estimating coupling between microstrip lines in arbitrary directions on adjacent layers in multi-layer printed circuit boards is studied: one line is embedded and the other is on the surface layer. Coupling or crosstalk has been estimated by development of a circuit-concept approach based on modified telegrapher's equations of the Agrawal approach instead of the Taylor approach for some computational advantages. Electromagnetic fields from the embedded microstrip line and the microstrip line on the surface can be obtained by using the electric image method for dielectric substrates. To verify the proposed approach, we conducted some experiments and compared the results of our approach with those of measurement and a commercial electromagnetic solver.},
keywords={},
doi={10.1587/transcom.E92.B.1945},
ISSN={1745-1345},
month={June},}
Copy
TY - JOUR
TI - Crosstalk Analysis for Embedded-Line Structure at PCB Using Circuit-Concept Approach
T2 - IEICE TRANSACTIONS on Communications
SP - 1945
EP - 1952
AU - Sang-Wook PARK
AU - Fengchao XIAO
AU - Yoshio KAMI
PY - 2009
DO - 10.1587/transcom.E92.B.1945
JO - IEICE TRANSACTIONS on Communications
SN - 1745-1345
VL - E92-B
IS - 6
JA - IEICE TRANSACTIONS on Communications
Y1 - June 2009
AB - An analytical method for estimating coupling between microstrip lines in arbitrary directions on adjacent layers in multi-layer printed circuit boards is studied: one line is embedded and the other is on the surface layer. Coupling or crosstalk has been estimated by development of a circuit-concept approach based on modified telegrapher's equations of the Agrawal approach instead of the Taylor approach for some computational advantages. Electromagnetic fields from the embedded microstrip line and the microstrip line on the surface can be obtained by using the electric image method for dielectric substrates. To verify the proposed approach, we conducted some experiments and compared the results of our approach with those of measurement and a commercial electromagnetic solver.
ER -
English
