As a promising lamination-loss-free fabrication technique, diffusion bonding of etched thin metal plates is used to realize double-layer waveguide slot antennas. Alternating-phase feed is adopted in this paper to reduce the number of laminated plates to simplify fabrication as well as to reduce cost. A 20 × 20-element double-layer waveguide slot antenna with a bottom partially-corporate feed circuit is designed for 39GHz band operation as an example. The adjacent radiating waveguides as well as the 2 × 2 sub-arrays fed in an alternating-phase manner eliminate the need for complete electrical contact in the top layer. However, the feed circuit in the bottom layer has to be completely diffusion-bonded. These two layers are simply assembled by screws. An antenna laminated by only diffusion bonding is also fabricated and evaluated for comparison. The comparison proved that the simply fabricated antenna is comparable in performance to the fully diffusion-bonded one.
Miao ZHANG
Tokyo Institute of Technology
Jiro HIROKAWA
Tokyo Institute of Technology
Makoto ANDO
Tokyo Institute of Technology
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Miao ZHANG, Jiro HIROKAWA, Makoto ANDO, "A Partially-Corporate Feed Double-Layer Waveguide Slot Array with the Sub-Arrays also Fed in Alternating-Phases" in IEICE TRANSACTIONS on Communications,
vol. E97-B, no. 2, pp. 469-475, February 2014, doi: 10.1587/transcom.E97.B.469.
Abstract: As a promising lamination-loss-free fabrication technique, diffusion bonding of etched thin metal plates is used to realize double-layer waveguide slot antennas. Alternating-phase feed is adopted in this paper to reduce the number of laminated plates to simplify fabrication as well as to reduce cost. A 20 × 20-element double-layer waveguide slot antenna with a bottom partially-corporate feed circuit is designed for 39GHz band operation as an example. The adjacent radiating waveguides as well as the 2 × 2 sub-arrays fed in an alternating-phase manner eliminate the need for complete electrical contact in the top layer. However, the feed circuit in the bottom layer has to be completely diffusion-bonded. These two layers are simply assembled by screws. An antenna laminated by only diffusion bonding is also fabricated and evaluated for comparison. The comparison proved that the simply fabricated antenna is comparable in performance to the fully diffusion-bonded one.
URL: https://global.ieice.org/en_transactions/communications/10.1587/transcom.E97.B.469/_p
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@ARTICLE{e97-b_2_469,
author={Miao ZHANG, Jiro HIROKAWA, Makoto ANDO, },
journal={IEICE TRANSACTIONS on Communications},
title={A Partially-Corporate Feed Double-Layer Waveguide Slot Array with the Sub-Arrays also Fed in Alternating-Phases},
year={2014},
volume={E97-B},
number={2},
pages={469-475},
abstract={As a promising lamination-loss-free fabrication technique, diffusion bonding of etched thin metal plates is used to realize double-layer waveguide slot antennas. Alternating-phase feed is adopted in this paper to reduce the number of laminated plates to simplify fabrication as well as to reduce cost. A 20 × 20-element double-layer waveguide slot antenna with a bottom partially-corporate feed circuit is designed for 39GHz band operation as an example. The adjacent radiating waveguides as well as the 2 × 2 sub-arrays fed in an alternating-phase manner eliminate the need for complete electrical contact in the top layer. However, the feed circuit in the bottom layer has to be completely diffusion-bonded. These two layers are simply assembled by screws. An antenna laminated by only diffusion bonding is also fabricated and evaluated for comparison. The comparison proved that the simply fabricated antenna is comparable in performance to the fully diffusion-bonded one.},
keywords={},
doi={10.1587/transcom.E97.B.469},
ISSN={1745-1345},
month={February},}
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TY - JOUR
TI - A Partially-Corporate Feed Double-Layer Waveguide Slot Array with the Sub-Arrays also Fed in Alternating-Phases
T2 - IEICE TRANSACTIONS on Communications
SP - 469
EP - 475
AU - Miao ZHANG
AU - Jiro HIROKAWA
AU - Makoto ANDO
PY - 2014
DO - 10.1587/transcom.E97.B.469
JO - IEICE TRANSACTIONS on Communications
SN - 1745-1345
VL - E97-B
IS - 2
JA - IEICE TRANSACTIONS on Communications
Y1 - February 2014
AB - As a promising lamination-loss-free fabrication technique, diffusion bonding of etched thin metal plates is used to realize double-layer waveguide slot antennas. Alternating-phase feed is adopted in this paper to reduce the number of laminated plates to simplify fabrication as well as to reduce cost. A 20 × 20-element double-layer waveguide slot antenna with a bottom partially-corporate feed circuit is designed for 39GHz band operation as an example. The adjacent radiating waveguides as well as the 2 × 2 sub-arrays fed in an alternating-phase manner eliminate the need for complete electrical contact in the top layer. However, the feed circuit in the bottom layer has to be completely diffusion-bonded. These two layers are simply assembled by screws. An antenna laminated by only diffusion bonding is also fabricated and evaluated for comparison. The comparison proved that the simply fabricated antenna is comparable in performance to the fully diffusion-bonded one.
ER -