3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing
Summary :
For the measurement of the 3D surface of micro-solderballs in IC (Integrated Circuit) manufacturing inspection, a binary grating project lenses of high MTF (Modulation Transfer Function) with tilted project plane is designed in this paper. Using a combination of lenses and a tilted optical layout both on object and image plane, the wave-front aberrations are reduced and the nonlinear image distortion is corrected with nonlinearity compensation, This optical lens allows us to project the structured light pattern to the inspected objects efficiently for clear deformed coded imaging, it could be used to online measure 3D shape of micro-solderballs with high precision and accuracy.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E89-C No.5 pp.602-607
- Publication Date
- 2006/05/01
- Publicized
- Online ISSN
- 1745-1353
- DOI
- 10.1093/ietele/e89-c.5.602
- Type of Manuscript
- Special Section PAPER (Special Section on Fundamental and Application of Advanced Semiconductor Devices)
- Category
- Si Devices and Processes
Authors
Keyword
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Shu YUAN, Dongping TIAN, Yanxing ZENG, "3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing" in IEICE TRANSACTIONS on Electronics,
vol. E89-C, no. 5, pp. 602-607, May 2006, doi: 10.1093/ietele/e89-c.5.602.
Abstract: For the measurement of the 3D surface of micro-solderballs in IC (Integrated Circuit) manufacturing inspection, a binary grating project lenses of high MTF (Modulation Transfer Function) with tilted project plane is designed in this paper. Using a combination of lenses and a tilted optical layout both on object and image plane, the wave-front aberrations are reduced and the nonlinear image distortion is corrected with nonlinearity compensation, This optical lens allows us to project the structured light pattern to the inspected objects efficiently for clear deformed coded imaging, it could be used to online measure 3D shape of micro-solderballs with high precision and accuracy.
URL: https://global.ieice.org/en_transactions/electronics/10.1093/ietele/e89-c.5.602/_p
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@ARTICLE{e89-c_5_602,
author={Shu YUAN, Dongping TIAN, Yanxing ZENG, },
journal={IEICE TRANSACTIONS on Electronics},
title={3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing},
year={2006},
volume={E89-C},
number={5},
pages={602-607},
abstract={For the measurement of the 3D surface of micro-solderballs in IC (Integrated Circuit) manufacturing inspection, a binary grating project lenses of high MTF (Modulation Transfer Function) with tilted project plane is designed in this paper. Using a combination of lenses and a tilted optical layout both on object and image plane, the wave-front aberrations are reduced and the nonlinear image distortion is corrected with nonlinearity compensation, This optical lens allows us to project the structured light pattern to the inspected objects efficiently for clear deformed coded imaging, it could be used to online measure 3D shape of micro-solderballs with high precision and accuracy.},
keywords={},
doi={10.1093/ietele/e89-c.5.602},
ISSN={1745-1353},
month={May},}
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TY - JOUR
TI - 3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing
T2 - IEICE TRANSACTIONS on Electronics
SP - 602
EP - 607
AU - Shu YUAN
AU - Dongping TIAN
AU - Yanxing ZENG
PY - 2006
DO - 10.1093/ietele/e89-c.5.602
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E89-C
IS - 5
JA - IEICE TRANSACTIONS on Electronics
Y1 - May 2006
AB - For the measurement of the 3D surface of micro-solderballs in IC (Integrated Circuit) manufacturing inspection, a binary grating project lenses of high MTF (Modulation Transfer Function) with tilted project plane is designed in this paper. Using a combination of lenses and a tilted optical layout both on object and image plane, the wave-front aberrations are reduced and the nonlinear image distortion is corrected with nonlinearity compensation, This optical lens allows us to project the structured light pattern to the inspected objects efficiently for clear deformed coded imaging, it could be used to online measure 3D shape of micro-solderballs with high precision and accuracy.
ER -
English
