High Density Packaging Technology Trend in Japan
Summary :
A trial definition and position of electronic packaging technology which consists of packaging process technology and packaging assembly technology is shown. Then, evaluation of packaging technology from the system engineer's point of view is discussed. In Japan, the most recent main packaging technology is SMT. But it may be only a passing point to COX. Finally a new concept on ultimate high density packaging is introduced.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E74-C No.8 pp.2297-2300
- Publication Date
- 1991/08/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section INVITED PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
- Category
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Fumio MIYASHIRO, "High Density Packaging Technology Trend in Japan" in IEICE TRANSACTIONS on Electronics,
vol. E74-C, no. 8, pp. 2297-2300, August 1991, doi: .
Abstract: A trial definition and position of electronic packaging technology which consists of packaging process technology and packaging assembly technology is shown. Then, evaluation of packaging technology from the system engineer's point of view is discussed. In Japan, the most recent main packaging technology is SMT. But it may be only a passing point to COX. Finally a new concept on ultimate high density packaging is introduced.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e74-c_8_2297/_p
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@ARTICLE{e74-c_8_2297,
author={Fumio MIYASHIRO, },
journal={IEICE TRANSACTIONS on Electronics},
title={High Density Packaging Technology Trend in Japan},
year={1991},
volume={E74-C},
number={8},
pages={2297-2300},
abstract={A trial definition and position of electronic packaging technology which consists of packaging process technology and packaging assembly technology is shown. Then, evaluation of packaging technology from the system engineer's point of view is discussed. In Japan, the most recent main packaging technology is SMT. But it may be only a passing point to COX. Finally a new concept on ultimate high density packaging is introduced.},
keywords={},
doi={},
ISSN={},
month={August},}
Copy
TY - JOUR
TI - High Density Packaging Technology Trend in Japan
T2 - IEICE TRANSACTIONS on Electronics
SP - 2297
EP - 2300
AU - Fumio MIYASHIRO
PY - 1991
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E74-C
IS - 8
JA - IEICE TRANSACTIONS on Electronics
Y1 - August 1991
AB - A trial definition and position of electronic packaging technology which consists of packaging process technology and packaging assembly technology is shown. Then, evaluation of packaging technology from the system engineer's point of view is discussed. In Japan, the most recent main packaging technology is SMT. But it may be only a passing point to COX. Finally a new concept on ultimate high density packaging is introduced.
ER -
English
