Present and Future Directions for Multichip Module Technologies

Toshio SUDO

Present and Future Directions for Multichip Module Technologies

Toshio SUDO

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Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.

Publication: IEICE TRANSACTIONS on Electronics Vol.E78-C No.6 pp.684-690

Publication Date: 1995/06/25

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Type of Manuscript: Special Section PAPER (Special Issue on the 1994 VLSI Circuits Symposium (Joint Issue with the IEEE Journal of Solid-State Circuits, Vol. 30, No. 4 April 1995))

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Toshio SUDO

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Toshio SUDO, "Present and Future Directions for Multichip Module Technologies" in IEICE TRANSACTIONS on Electronics, vol. E78-C, no. 6, pp. 684-690, June 1995, doi: .
Abstract: Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e78-c_6_684/_p

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@ARTICLE{e78-c_6_684,
author={Toshio SUDO, },
journal={IEICE TRANSACTIONS on Electronics},
title={Present and Future Directions for Multichip Module Technologies},
year={1995},
volume={E78-C},
number={6},
pages={684-690},
abstract={Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.},
keywords={},
doi={},
ISSN={},
month={June},}

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TY - JOUR
TI - Present and Future Directions for Multichip Module Technologies
T2 - IEICE TRANSACTIONS on Electronics
SP - 684
EP - 690
AU - Toshio SUDO
PY - 1995
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E78-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 1995
AB - Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.
ER -