Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices
Summary :
We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices. Though the liquid resins have a characteristics as low as one tenth of the surface tension of solder in general, restoring forces for self-alignment capability can be produced by making it constrained on the 3-dimensional pads on chip and substrate. In this paper, its principle and characteristics are described and the relationship between process parameters and joint geometry were examined. And the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. A self-alignment accuracy was examined experimentally and show that it became less than 0.4 µm. It can provide a useful information on various parameters involved in joint geometry and optimal design guideline to generate the proper profiles.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E84-C No.12 pp.1967-1974
- Publication Date
- 2001/12/01
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- PAPER
- Category
- Optoelectronics
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Kozo FUJIMOTO, Jong-Min KIM, Shuji NAKATA, "Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices" in IEICE TRANSACTIONS on Electronics,
vol. E84-C, no. 12, pp. 1967-1974, December 2001, doi: .
Abstract: We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices. Though the liquid resins have a characteristics as low as one tenth of the surface tension of solder in general, restoring forces for self-alignment capability can be produced by making it constrained on the 3-dimensional pads on chip and substrate. In this paper, its principle and characteristics are described and the relationship between process parameters and joint geometry were examined. And the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. A self-alignment accuracy was examined experimentally and show that it became less than 0.4 µm. It can provide a useful information on various parameters involved in joint geometry and optimal design guideline to generate the proper profiles.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e84-c_12_1967/_p
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@ARTICLE{e84-c_12_1967,
author={Kozo FUJIMOTO, Jong-Min KIM, Shuji NAKATA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices},
year={2001},
volume={E84-C},
number={12},
pages={1967-1974},
abstract={We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices. Though the liquid resins have a characteristics as low as one tenth of the surface tension of solder in general, restoring forces for self-alignment capability can be produced by making it constrained on the 3-dimensional pads on chip and substrate. In this paper, its principle and characteristics are described and the relationship between process parameters and joint geometry were examined. And the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. A self-alignment accuracy was examined experimentally and show that it became less than 0.4 µm. It can provide a useful information on various parameters involved in joint geometry and optimal design guideline to generate the proper profiles.},
keywords={},
doi={},
ISSN={},
month={December},}
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TY - JOUR
TI - Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices
T2 - IEICE TRANSACTIONS on Electronics
SP - 1967
EP - 1974
AU - Kozo FUJIMOTO
AU - Jong-Min KIM
AU - Shuji NAKATA
PY - 2001
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E84-C
IS - 12
JA - IEICE TRANSACTIONS on Electronics
Y1 - December 2001
AB - We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices. Though the liquid resins have a characteristics as low as one tenth of the surface tension of solder in general, restoring forces for self-alignment capability can be produced by making it constrained on the 3-dimensional pads on chip and substrate. In this paper, its principle and characteristics are described and the relationship between process parameters and joint geometry were examined. And the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. A self-alignment accuracy was examined experimentally and show that it became less than 0.4 µm. It can provide a useful information on various parameters involved in joint geometry and optimal design guideline to generate the proper profiles.
ER -
English
